Parametric study in similar ultrasonic spot welding of A5052-H32 alloy sheets

Shin, Hyung-Seop; Leon, Michael de

doi:10.1016/j.jmatprotec.2015.05.013

Cited by 50 publications

(13 citation statements)

References 11 publications

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“…The surface of the bonding tool is conventionally machined in a knurled pattern to clamp the bonding material and to cause interfacial friction. However, penetration of the knurled edge during the bonding process occasionally damages the bonding materials [19]. In the manufacture of lithium-ion batteries, a cover sheet is generally lapped over to prevent any damage to the underlying multi-layered foil.…”

Section: Introductionmentioning

confidence: 99%

Ultrasonic Bonding of Multi-Layered Foil Using a Cylindrical Surface Tool

Arimoto

Sasaki

Doi

et al. 2019

Metals

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A cylindrical tool was applied for ultrasonic bonding of multi-layered copper foil and a copper sheet to prevent damage to the foil during bonding. The strength of the joints bonded with the cylindrical tool was comparable to that of the joints bonded with a conventional knurled tool. The effect of the cylindrical surface tool on bondability was investigated thorough relative motion behaviors between the tool surface and the bonding materials, as well as on bond microstructure evolution. The relative motion was visualized with in-situ observation using a high-speed camera and digital image correlation. At shorter bonding times, relative motions occurred at the bonding interfaces of the foil and the copper sheet. Thereafter, the relative motion between the tool and the bonding material became predominant owing to bond formation at the bonding interface, resulting in a macroscopic plastic flow in the bonded region. This relative motion damaged the foil in knurled tool bonding, and the cylindrical tool achieved bonding without any damage.

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Section: Introductionmentioning

confidence: 99%

Ultrasonic Bonding of Multi-Layered Foil Using a Cylindrical Surface Tool

Arimoto

Sasaki

Doi

et al. 2019

Metals

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“…It was reported that the interface changed from a planner to a wavy morphology, and that the weld strength increases as the welding energy increases. Shin and de Leon [ 10 ] studied the process parameters, including the vibration amplitude, the welding duration, the horn, and the anvil tip patterns for the A5052 Al alloy joints. It was concluded that the mechanical properties and weld quality of the joints were governed by these parameters.…”

Section: Introductionmentioning

confidence: 99%

The Effect of Welding Energy on the Microstructural and Mechanical Properties of Ultrasonic-Welded Copper Joints

Yang

Biao

2017

Materials

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The effects of welding energy on the mechanical and microstructural characteristics of ultrasonic-welded pure copper plates were investigated. Complex dynamic recrystallization and grain growth occurred inside the weld zone during ultrasonic welding. At a low welding energy, a thin band of straight weld interfaces was observed and had an ultra-fine grain structure. With an increase in welding energy, the weld interface progressively changed from flat to sinusoidal, and eventually turned into a convoluted wavy pattern, bearing similarities to shear instabilities, as observed in fluid dynamics. The lap shear load of the joints initially increased and then remained stable as the welding energy increased. The tensile characteristics of the joints significantly depended on the development of plastic deformation at the interface. The influence of the microstructure on the hardness was also discussed.

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“…They suggested the temperature was highest around the central bonding area under the solenoid tip. Other researchers also reported the temperature at the bonding interface of ultrasonic boding [119][120][121]. To reduce the friction between ultrasonic interfaces, authors have used soft and ductile Sn-3.5%Ag alloy and obtained a maximum temperature of 80 • C at ultrasonic power of 1.4 kW [122].…”

Section: Recrystallization In Wedge Bondingmentioning

confidence: 99%

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

Kang

Sharma

Jung

2020

Metals

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Transient liquid phase (TLP) bonding is a novel bonding process for the joining of metallic and ceramic materials using an interlayer. TLP bonding is particularly crucial for the joining of the semiconductor chips with expensive die-attached materials during low-temperature sintering. Moreover, the transient TLP bonding occurs at a lower temperature, is cost-effective, and causes less joint porosity. Wire bonding is also a common process to interconnect between the power module package to direct bonded copper (DBC). In this context, we propose to review the challenges and advances in TLP and ultrasonic wire bonding technology using Sn-based solders for power electronics packaging.

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Parametric study in similar ultrasonic spot welding of A5052-H32 alloy sheets

Cited by 50 publications

References 11 publications

Ultrasonic Bonding of Multi-Layered Foil Using a Cylindrical Surface Tool

Ultrasonic Bonding of Multi-Layered Foil Using a Cylindrical Surface Tool

The Effect of Welding Energy on the Microstructural and Mechanical Properties of Ultrasonic-Welded Copper Joints

Recent Progress in Transient Liquid Phase and Wire Bonding Technologies for Power Electronics

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