ABSTRACT:The structure of the interfaces between silicon and silicon-oxide are responsible for proper functioning of MOSFET devices while defects in the interface can deteriorate this function and lead to theirs failure. In this paper we modeled this interface and characterized its defects and strain. MD simulations were used for reconstructing interfaces into a thermodynamically stable configuration. In all modeled interfaces, defects were found in form of three-coordinated silicon atom, five coordinated silicon atom, threefold-coordinated oxygen atom or displaced oxygen atom. Three-coordinated oxygen atom can be 2 created if dangling bonds on silicon are close enough. The structure and stability of three-coordinated silicon atoms (Pb defect) depend on the charge as well as on the electric field across the interface. The negatively charged Pb defect is the most stable one, but the electric field resulting from the interface reduces that stability. Interfaces with large differences in periodic constants of silicon and silicon oxide can be stabilized by buckling of silicon layer. Mechanical stress resulted from the interface between silicon and silicon oxide is greater in the silicon oxide layer. Ab-initio modeling of clusters representing silicon and silicon oxide shows about three time larger susceptibility to strain in silicon oxide than in silicon if exposed to the same deformation.