Void evolution in silicon under inert and dry oxidizing ambient annealing and the role of a Si1−xGex epilayer cap J. Appl. Phys. 112, 054909 (2012) Predicting effective permittivity of composites containing conductive inclusions at microwave frequencies AIP Advances 2, 032109 (2012) Computational measurement of void percolation thresholds of oblate particles and thin plate composites J. Appl. Phys. 111, 124903 (2012) Vacancy clustering and its dissociation process in electroless deposited copper films studied by monoenergetic positron beams J. Appl. Phys. 111, 104506 (2012) A molecular "phase ordering" phase transition leading to a modulated aperiodic composite in n-heptane/urea A review is presented of the recent advances in the study of oxygen precipitation and of the main properties of oxide precipitates in silicon. After a general overview of the system "oxygen in silicon," the thermodynamic% and the kinetics of the precipitate formation are treated in detail, with major emphasis on the phenomenology; subsequently, the most important techniques for the characterization of the precipitates are illustrated together with the most interesting and recent results. Finally, the' possible influence of oxygen precipitation on technological applications is stressed, with particular attention to recent results regarding device yield. Actually, the essential novelty of this review rests on the attempt to give an extended picture of what has been recently clarified by means of highly sophisticated diagnostic methods and of the influence of precipitation on the properties of semiconductor devices. 0 1995 American Institute of Physics.~.

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The control of the self-assembly (SA) process and nanostructure orientation in diblock copolymer (DBC) thick films is a crucial technological issue. Perpendicular orientation of the nanostructures in symmetric and asymmetric poly(styrene)-b-poly(methyl methacrylate) (PS-b-PMMA) block copolymer films obtained by means of simple thermal treatments was demonstrated to occur in well-defined thickness windows featuring modest maximum values, thus resulting in low aspect ratio (h/d < 2) of the final lithographic mask. In this manuscript, the thickness window corresponding to the perpendicular orientation of the cylindrical structures in asymmetric DBC is investigated at high temperatures (190 °C ≤ T ≤ 310 °C) using a rapid thermal processing machine. A systematic study of the annealing conditions (temperature and time) of asymmetric PS-b-PMMA (Mn = 67.1, polydispersity index = 1.09) films, with thicknesses ranging from 10 to 400 nm, allowed ordered patterns, with a maximum value of orientational correlation length of 350 nm, to be obtained for film thicknesses up to 200 nm. The complete propagation of the cylindrical structures through the whole film thickness in a high aspect ratio PS template (h/d ≈ 7) is probed by lift-off process. Si nanopillars are obtained having the same lateral ordering and characteristic dimensions of the DBC lithographic mask as further confirmed by grazing-incidence small-angle X-ray scattering experiments.

A single chamber system for plasma-enhanced chemical vapor deposition was employed to deposit different films of SiOx:N,H with 0.85⩽x⩽1.91, which are studied here by Fourier transform infrared transmission spectroscopy. The sample composition was determined by Rutherford backscattering spectrometry, nuclear reaction, and elastic recoil detection analysis. Moreover, physical properties such as thickness uniformity, deposition rate, density, wet and dry etch rates, and stress are determined. A quantitative study of Si–OH, N–H, and Si–H bonds was performed and interpreted on the basis of the random bonding model; in addition, the presence of NH2, Si–O–Si, H2SiO2, and Si–N groups was detected. The effect of sample annealing at 600 and 900 °C was studied and two species of Si–H bonds were identified, one more stable and the other one easily releasable. A reordering effect of annealing was also detected as a reduction of the amorphous network stress and as the increase of the bond angle in the Si–O–Si groups up to the value typical of thermal SiO2.

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