Abstract:Abstract. Packaging is one of the major cost drivers for MEMS devices. Currently wire bonding is the dominant method for electrically connecting MEMS chips to substrate. Using self-alignment a method for packaging multiple MEMS at the same time has been developed. The presented process achieves high throughput and precise alignment at low cost. The Controlled Collapse Re-flow Chip Joining (C-4) process has been adapted to the specific requirements of MEMS. The combination of coarse robotics and liquid solder s… Show more
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