Parallel C4 Packaging of MEMS Using Self-Alignment: Simulation and Experiments

Taprogge, Jens L. M.; Beyeler, Felix; Steinecker, A.; Nelson, Bradley J.

doi:10.1109/tcpmt.2013.2254489

Cited by 4 publications

(4 citation statements)

References 37 publications

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“…72 Millimeter-sized MEMS force sensors were picked up and precisely aligned to a pre-patterned printed circuit board (PCB). 73 The capillary force of molten solder bumps between matching pads on both board and sensors was exploited, and three devices were assembled simultaneously. A capillary approach was also applied to the fluidic assembly of a GaAs-based microcantilever spin injector, 70 microcantilever for atomic force microscopy, 71 and of millimeter-sized components with inner cavities.…”

Section: Shape Matchingmentioning

confidence: 99%

“…110 One issue with traditional solders can be the required high melting temperatures, not compatible with heat-sensitive materials and components. Low melting point solders, 111,112 such as Bi/Sn/Pb (46/34/20) 73 are therefore used. Another issue, often hindering solder self-alignment and interconnect reliability, is insufficient wetting or adhesion caused by solder or pad oxidation.…”

Section: Process Integrationmentioning

confidence: 99%

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Surface tension-driven self-alignment

et al. 2017

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Surface tension-driven self-alignment is a passive and highly-accurate positioning mechanism that can significantly simplify and enhance the construction of advanced microsystems. After years of research, demonstrations and developments, the surface engineering and manufacturing technology enabling capillary self-alignment has achieved a degree of maturity conducive to a successful transfer to industrial practice. In view of this transition, a broad and accessible review of the physics, material science and applications of capillary self-alignment is presented. Statics and dynamics of the self-aligning action of deformed liquid bridges are explained through simple models and experiments, and all fundamental aspects of surface patterning and conditioning, of choice, deposition and confinement of liquids, and of component feeding and interconnection to substrates are illustrated through relevant applications in micro- and nanotechnology. A final outline addresses remaining challenges and additional extensions envisioned to further spread the use and fully exploit the potential of the technique.

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Section: Shape Matchingmentioning

confidence: 99%

Section: Process Integrationmentioning

confidence: 99%

Surface tension-driven self-alignment

et al. 2017

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“…This fully‐constrained modality of capillary self‐centering is called capillary self‐alignment . It represents a passive, autonomous and powerful manipulation technique that can rival and enhance the accuracy of high‐performance robotic equipment for precision handling. This was first evidenced in microelectronic packaging.…”

Section: Assembly and Manipulation: The Fluid Joint As Capillary Linkermentioning

confidence: 99%

The Fluid Joint: The Soft Spot of Micro‐ and Nanosystems

Mastrangeli

2015

Advanced Materials

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Fluid bridges are ubiquitous soft structures of finite size that conform to and link the surfaces of neighboring objects. Fluid joints, the specific type of fluid bridge with at least one extremity constrained laterally, display even more pronounced reactivity and self-restoration, which make them remarkably suited for assembly, actuation, and manipulation purposes. Their peculiar surface and bulk properties place fluid joints at the rich intersection of diverse scientific interests, and foster their widespread use throughout micro- and nanotechnology. A critical survey of the mechanics and of the manifold applications of fluid bridges and joints in micro- and nanosystems is presented here, along with current challenges and multidisciplinary perspectives.

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“…Liquid confinement can be enforced through either topographical [25] and/or chemical [24] surface structuring. Earlier works by Smith [26], Morris [27], and Chung [20] and Taprogge [28] showed how the parallel formation of working electrical and mechanical interconnections can be included in fluidic self-assembly processes. Xiong used 1057-7157 © 2014 IEEE.…”

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confidence: 99%