Parallel optical link (PAROLI) for multichannel gigabit rate interconnections

Karstensen, H.; Melchior, L.; Plickert, V.; Drögemüller, K.; Blank, J.; Wipiejewski, T.; Wolf, H. D.; Wieland, J.; Jeiter, G.; Dal’Ara, Roberto; Bläser, Markus

doi:10.1109/ectc.1998.678791

Cited by 26 publications

(4 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…9, September 2001, pp. 793-799 current optical interconnection modules are moving from the pigtail to connector structure, the position of developing modules has been inherited [2][3][4]. Therefore, the tasks of handling the optical fiber slack and connecting the connectors on the printed-circuit board are still essential.…”

Section: Introductionmentioning

confidence: 99%

Large‐tolerant “OptoBump” interface for interchip optical interconnections

Ishii

Arai

2002

Electron Comm Jpn Pt II

View full text Add to dashboard Cite

SUMMARYOptical interconnection technology for optical interboard and interchip connections will be an important technology in the next-generation communication equipment seeking a high-capacity throughput at the terabit per second level. With the objective of establishing an economical optical packaging technology, we propose an "optical I/O chip package," which is an optical package for the hybrid integration of optoelectric (O/E) devices and LSI chips that can be mounted on a printed-circuit board by standard surface mount technology (SMT). In this paper, we propose the OptoBump interface as the optical interconnection between the optical package and the board that connects these two elements by forming the microlens on both and using collimated light. Accommodating the fibers on the board and connecting the connectors become unnecessary because the connections having large beam diameters are able to tolerate offsets in the SMT mounting position. First, we calculated the required collimated beam diameter of 104 µm under the assumption of an SMT accuracy of ±50 µm.Next, we applied ray tracing to estimate the optical losses of the 45° mirror at the polymer optical waveguide facet integrated into the printed-circuit substrate and clearly exhibited the incident beam conditions with both improved losses and tolerances. And we integrated the polymer microlens into the polymer optical waveguide and the surface-emitting laser (VCSEL) and experimentally evaluated the optical coupling performance between them. The results verified a 1-dB tolerance at ±50 µm and demonstrated the effectiveness of this proposal.

show abstract

Section: Introductionmentioning

confidence: 99%

Large‐tolerant “OptoBump” interface for interchip optical interconnections

Ishii

Arai

2002

Electron Comm Jpn Pt II

View full text Add to dashboard Cite

show abstract

“…Recently, the speed per channel in the parallel optical interconnections technology has been increased. Speeds exceeding 1.2 Gb/s have been reported [12]. Such improvement of the speed per channel is largely due to advances in LSI technology.…”

Section: Future Prospects Of Optical I/o MCMmentioning

confidence: 98%

An 80 Gb/s optical I/O interface ATM switch MCM

Kawano

Yamanaka

Oki

et al. 2001

Electron. Comm. Jpn. Pt. I

View full text Add to dashboard Cite

SUMMARYFor extensive proliferation of multimedia communications, high-speed, large-capacity node systems are required in addition to the technologies for transmission and access systems. Although the performance of the node system has progressed along with the technical advances of LSI, the LSI interconnection is now a bottleneck due to rapid advances in technology, and consequently this bottleneck may limit the performance of the node system. One way to resolve this situation and extract the performance of the LSI at the maximum is the multichip module (MCM) technology. Using this technology, high-speed, multiply parallel signal transmission can be realized within MCM. However, the input and output of the signal to this MCM still suffers from bottlenecks in terms of connection distance, cable physical volume, transmission speed, flexibility, and antinoise properties so long as the conventional electric I/O is used. In order to resolve this interconnect bottleneck, the authors have developed an optical I/O interface ATM switch MCM in which the optical signal can directly enter and exit the MCM. This module is realized with 0.

show abstract

“…Moreover they are insensitive to electromagnetic interferences. However, these modules that find their origin in the Siemens' PAROLI precursor [4], already suffer from inherent limitations: mainly cost, large form factors, power dissipation and data rate. They embed VCSELs as light emitters, whose theoretical bandwidth could be pushed to 20 GHz, assuming that 10 Gbps VCSELs are nowaday a standard widely used in 10G Ethernet LANs.…”

Section: Introductionmentioning

confidence: 99%

Merging parallel optics packaging and surface mount technologies

et al. 2008

View full text Add to dashboard Cite

Optical links are well known to present significant advantages over electrical links for very high-speed data rate at 10Gpbs and above per channel. However, the transition towards optical interconnects solutions for short and very short reach applications requires the development of innovative packaging solutions that would deal with very high volume production capability and very low cost per unit. Moreover, the optoelectronic transceiver components must be able to move from the edge to anywhere on the printed circuit board, for instance close to integrated circuits with high speed IO. In this paper, we present an original packaging design to manufacture parallel optic transceivers that are surface mount devices. The package combines highly integrated Multi-Chip-Module on glass and usual IC ceramics packaging. The use of ceramic and the development of sealing technologies achieve hermetic requirements. Moreover, thanks to a chip scale package approach the final device exhibits a much minimized footprint. One of the main advantages of the package is its flexibility to be soldered or plugged anywhere on the printed circuit board as any other electronic device. As a demonstrator we present a 2 by 4 10Gbps transceiver operating at 850nm.

show abstract

Parallel optical link (PAROLI) for multichannel gigabit rate interconnections

Cited by 26 publications

References 7 publications

Large‐tolerant “OptoBump” interface for interchip optical interconnections

Large‐tolerant “OptoBump” interface for interchip optical interconnections

An 80 Gb/s optical I/O interface ATM switch MCM

Merging parallel optics packaging and surface mount technologies

Contact Info

Product

Resources

About