2020
DOI: 10.1016/j.matdes.2020.109020
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Paraelectric/antiferroelectric/ferroelectric phase transformation in As-deposited ZrO2 thin films by the TiN capping engineering

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Cited by 26 publications
(25 citation statements)
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“…For instance, electrode materials , and interface layers can play a role, but stress and strain can favor the o-phase too. In contrast, crystallization in the m-phase is often observed for atomic layer deposited (ALD)-doped HfO 2 or mixed Hf x Zr 1– x O 2 films above 20 nm. ,, …”
Section: Introductionmentioning
confidence: 99%
“…For instance, electrode materials , and interface layers can play a role, but stress and strain can favor the o-phase too. In contrast, crystallization in the m-phase is often observed for atomic layer deposited (ALD)-doped HfO 2 or mixed Hf x Zr 1– x O 2 films above 20 nm. ,, …”
Section: Introductionmentioning
confidence: 99%
“…In the past decade, it has been reported that the TiN capping on Hf 0.5 Zr 0.5 O 2 thin films followed by the annealing at high temperatures induces the presence of the ferroelectric orthorhombic phase. In our previous study, the PE/AFE/ferroelectric phase transition in ZrO 2 thin films was demonstrated by engineering, i.e., capping or removing, the TiN capping layer . However, the dependences of the dielectric properties of ZrO 2 on the TiN layer thickness and the chemical states at the interface were unclear.…”
Section: Introductionmentioning
confidence: 96%
“…26−29 In our previous study, the PE/AFE/ ferroelectric phase transition in ZrO 2 thin films was demonstrated by engineering, i.e., capping or removing, the TiN capping layer. 30 However, the dependences of the dielectric properties of ZrO 2 on the TiN layer thickness and the chemical states at the interface were unclear. In this study, the impacts of the TiN layer thickness, strain, and interfacial properties are investigated in detail to explore the origin of antiferroelectricity.…”
Section: ■ Introductionmentioning
confidence: 99%
“…Furthermore, ZrO 2 is associated with the lowest material cost in an HfO 2 –ZrO 2 system and is thus suitable for use in the aforementioned applications. However, owing to the high thermal stability of the t-phase of ZrO 2 thin films, it is difficult to induce the o-phase without adopting the deposition method and considering the surface structure of the bottom electrode . It was recently reported that the ferroelectricity of ZrO 2 could be demonstrated through the chemical solution deposition process and plasma-enhanced atomic layer deposition (PEALD). , Furthermore, it was reported that by performing PEALD in conjunction with the construction of the Pt surface structure, a large ferroelectricity comparable to a remanent polarization of approximately 50 μC/cm 2 could be achieved in an approximately 7 nm thick ZrO 2 film .…”
Section: Introductionmentioning
confidence: 99%
“…However, owing to the high thermal stability of the t-phase of ZrO 2 thin films, it is difficult to induce the o-phase without adopting the deposition method and considering the surface structure of the bottom electrode . It was recently reported that the ferroelectricity of ZrO 2 could be demonstrated through the chemical solution deposition process and plasma-enhanced atomic layer deposition (PEALD). , Furthermore, it was reported that by performing PEALD in conjunction with the construction of the Pt surface structure, a large ferroelectricity comparable to a remanent polarization of approximately 50 μC/cm 2 could be achieved in an approximately 7 nm thick ZrO 2 film . The control of the crystalline phase and ferroelectricity through the post-deposition process has not been reported, despite its technological importance in expanding the range of processes for the application of ZrO 2 -based ferroelectrics.…”
Section: Introductionmentioning
confidence: 99%