Panel Level Packaging - From Idea to Industrialization -

Braun, T.; Schuster, Martin; Lang, Klaus‐Dieter; Becker, Karl‐Friedrich; Hoelck, Ole; Voges, S.; Boettcher, Lars; Topper, Michael J.; Stobbe, L.; Aschenbrenner, R.; Voitel, Marcus

doi:10.1109/icsj47124.2019.8998753

2019 IEEE CPMT Symposium Japan (ICSJ) 2019

DOI: 10.1109/icsj47124.2019.8998753

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Panel Level Packaging - From Idea to Industrialization -

T. Braun

Martin Schuster

Klaus‐Dieter Lang

et al.

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Cited by 6 publications

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Panel‐Level Packaging for Heterogenous Integration

Topper¹,

Braun²,

Billaud³

et al. 2021

Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces

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Panel Level Packaging - From Idea to Industrialization -

Cited by 6 publications

References 1 publication

Panel‐Level Packaging for Heterogenous Integration

Panel‐Level Packaging for Heterogenous Integration

Panel Level Packaging – Where are the Technology Limits?

A Closer Look to Fan-out Panel Level Packaging

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