Packaging Technology for the NEC SX Supercomputer

Murano, Hiroshi; Watari, T.

doi:10.1109/tchmt.1985.1136535

Cited by 84 publications

(10 citation statements)

References 2 publications

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“…1.9. 19,20 This cooling scheme is very much similar to the IBM thermal conduction module. There are 36 back-bonded chips on a multi-layer ceramic substrate.…”

Section: Nec-sx-3mentioning

confidence: 99%

Data Centers and Thermal Management Approaches

Sammakia

Joshi

Agonafer

et al. 2014

Encyclopedia of Thermal Packaging

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“…1.9. 19,20 This cooling scheme is very much similar to the IBM thermal conduction module. There are 36 back-bonded chips on a multi-layer ceramic substrate.…”

Section: Nec-sx-3mentioning

confidence: 99%

Data Centers and Thermal Management Approaches

Sammakia

Joshi

Agonafer

et al. 2014

Encyclopedia of Thermal Packaging

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“…Despite being expensive, platinum is generally the preferred choice due to its being non-reactive in most environments of deployment, low electrical resistance, high sensitivity and high melting point making it suitable for precise measurements within the range of -260 °C to 1,000 °C. 19 Copper and nickel are used due to costs restrictions, in limited operation temperature ranges, or when a larger uncertainty in measurement is not a concern.…”

Section: Sensors Typesmentioning

confidence: 99%

“…The basic principle of operation for thermocouples is the "Seebeck Effect", also called the thermoelectric effect. The voltage created is proportional to the temperature difference across the "measured" junction (T measured ) and "reference" junction (T reference ), 19 see Fig. 6.11.…”

Section: Sensors Typesmentioning

confidence: 99%

Thermal Measurements and Their Use in Data Centers

Sammakia

Joshi

Agonafer

et al. 2014

Encyclopedia of Thermal Packaging

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Encyclopedia of Thermal Packaging Downloaded from www.worldscientific.com by NANYANG TECHNOLOGICAL UNIVERSITY on 08/24/15. For personal use only. Encyclopedia of Thermal Packaging Downloaded from www.worldscientific.com by NANYANG TECHNOLOGICAL UNIVERSITY on 08/24/15. For personal use only. Encyclopedia of Thermal Packaging Downloaded from www.worldscientific.com by NANYANG TECHNOLOGICAL UNIVERSITY on 08/24/15. For personal use only.

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“…IBM had determined that the most effective way to manage chip temperatures in these systems was through the use of indirect water-cooling [2]. Several other mainframe manufacturers also came to the same conclusion [3][4][5][6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Flow network analysis of the IBM Power 775 supercomputer Water Cooling System

Ellsworth¹

2014

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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In 2011 IBM announced the Power 775 Supercomputing node/system which, for the time, was a monumental leap forward in computing performance and energy efficiency. The system was designed from the start with water cooling in mind. The result: a system with greater than 95% of its heat load conducted directly to water and a system that, together with a rear door heat exchanger, removes 100% of its heat load to water with no requirement for room air conditioning. In addition to direct water cooling the processor, the memory, power conversion, and I/O electronics also conduct their heat directly to water. Also included within the framework of the system is a disk storage unit (i.e. disc enclosure) containing an interboard air-to-water heat exchanger.A detailed flow network analysis was undertaken to assure adequate flow to all components in the system while minimizing pump power consumption for a wide range of system configurations. The analysis was validated by both early development experimentation as well as final system verification. The network analysis could therefore be used to establish pump speed tables for normal and abnormal modes of operation. This paper will outline the assumptions and methodology associated with the flow network analysis and demonstrates how the analysis was used for the design and operation of the water cooling system. NOMENCLATUREA cross sectional area, m 2 BPA bulk power conversion assembly C1 flow impedance coefficient, N-s/m 5 C2 flow impedance coefficient, N-s 2 /m 8 CEC central electronics complex DCCA distributed converter and control assembly ¡P differential pressure, Pa EPDM ethylene propylene diene monomer (M-class) rubber FIFO first in, first out FNM Flow Network Modeling gpm gallons per minute (1 gpm = 6.30902E-5 m 3 /s) ID inner diameter in inches k loss coefficient kPa kilopascals (10 3 Pa) OD outer diameter Pa Pascal (unit of pressure = 1 N/m 2 ) Q volumetric flow rate, m 3 /s RDHx rear door heat exchanger RPM rotations per minute (pump speed) WCU water conditioning unit Greek symbols ρ mass density (kg/m 3 )

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Packaging Technology for the NEC SX Supercomputer

Cited by 84 publications

References 2 publications

Data Centers and Thermal Management Approaches

Data Centers and Thermal Management Approaches

Thermal Measurements and Their Use in Data Centers

Flow network analysis of the IBM Power 775 supercomputer Water Cooling System

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