Packaging of High-Gain Multichip Module in Multilayer LCP Substrates at $W$ -Band

Zhang, Yifei; Shi, Shouyuan; Martin, Robert; Wright, A.; Yao, Peng; Shreve, Kevin; Harrity, Charles; Prather, Dennis W.

doi:10.1109/tcpmt.2017.2737550

Cited by 10 publications

(3 citation statements)

References 28 publications

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“…In 2013, Chlieh et al integrated gallium nitride (GaN) amplifiers and microfluidic cooling in a multilayer LCP substrate for high-power applications at 5 GHz [114]. In 2017, Zhang et al developed an MCM integration and packaging approach in the W-band, achieving a high gain of 50 dB, a low noise figure of less than 6 dB, and a linear phase from 80 to 97 GHz [115]. Jiang et al reported on the use of LCP packages for miniaturized magnetoelastic resonators for tagging applications in 2019, expanding the application ranges of LCPs [116].…”

Section: Chip Integration and Packgingmentioning

confidence: 99%

“…With a low bonding profile, i.e., small wire length and lift height, wire bonding can allow broadband low-loss properties up to 77 GHz [119] and narrowband low-loss properties up to 122 GHz [120]. Zhang developed V-shaped wire bonding techniques for the integration of wideband indium phosphide (InP) LNA on LCP substrates in 2017, achieving low insertion loss up to 110 GHz [115], as shown in Figure 9a. Due to the small interconnect profile, flip-chip bonding addresses the low loss by using gold balls or posts at mmW and THz frequencies [121][122][123][124].…”

Section: Integraion Technologiesmentioning

confidence: 99%

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Flexible Liquid Crystal Polymer Technologies from Microwave to Terahertz Frequencies

Zhou

Qian

et al. 2022

Molecules

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With the emergence of fifth-generation (5G) cellular networks, millimeter-wave (mmW) and terahertz (THz) frequencies have attracted ever-growing interest for advanced wireless applications. The traditional printed circuit board materials have become uncompetitive at such high frequencies due to their high dielectric loss and large water absorption rates. As a promising high-frequency alternative, liquid crystal polymers (LCPs) have been widely investigated for use in circuit devices, chip integration, and module packaging over the last decade due to their low loss tangent up to 1.8 THz and good hermeticity. The previous review articles have summarized the chemical properties of LCP films, flexible LCP antennas, and LCP-based antenna-in-package and system-in-package technologies for 5G applications, although these articles did not discuss synthetic LCP technologies. In addition to wireless applications, the attractive mechanical, chemical, and thermal properties of LCP films enable interesting applications in micro-electro-mechanical systems (MEMS), biomedical electronics, and microfluidics, which have not been summarized to date. Here, a comprehensive review of flexible LCP technologies covering electric circuits, antennas, integration and packaging technologies, front-end modules, MEMS, biomedical devices, and microfluidics from microwave to THz frequencies is presented for the first time, which gives a broad introduction for those outside or just entering the field and provides perspective and breadth for those who are well established in the field.

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Section: Chip Integration and Packgingmentioning

confidence: 99%

Section: Integraion Technologiesmentioning

confidence: 99%

Flexible Liquid Crystal Polymer Technologies from Microwave to Terahertz Frequencies

Zhou

Qian

et al. 2022

Molecules

Self Cite

View full text Add to dashboard Cite

show abstract

“…To achieve both high-performance and low-profile, the 3-dimensional (3-D) system-in-package (SiP) has been an attractive and efficient approach to produce MMW wireless systems [7,8,9,10]. At present, low temperature co-fired ceramic (LTCC) [11,12,13,14,15], highdensity interconnect (HDI) [16,17,18,19,20], and embedded wafer level ball grid array (eWLB) [21,22,23,24,25] have all been demonstrated for mass production of MMW SiPs. However, the selection for MMW SiP is a tradeoff among compactness, cost, electrical performance and thermo-mechanical reliability [26].…”

Section: Introductionmentioning

confidence: 99%

Si-based system-in-package design with broadband interconnection for E-band applications

Chu

Zhou

et al. 2021

IEICE Electron. Express

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This letter presents a silicon-based package design for E-band communication systems. As the primary concern to package, the radiofrequency (RF) interconnection from carrier board to the die is carefully designed based on the impedance transformation characteristic of the transmission line (TL). In addition, the simulation results show that the designed interconnection is robust to moderate process deviations. To verify the electrical performance of the designed interconnection, a dummy testing structure is designed, fabricated and measured. The measurement results show that the return loss is less than −10.6 dB in the commercial communication frequency range of 71-86 GHz for E-band applications.

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High-Stability Front-End Modules with Directional Filters for W-Band Imaging

Li,

Cui,

et al. 2023

2023 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-A

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Packaging of High-Gain Multichip Module in Multilayer LCP Substrates at $W$ -Band

Cited by 10 publications

References 28 publications

Flexible Liquid Crystal Polymer Technologies from Microwave to Terahertz Frequencies

Flexible Liquid Crystal Polymer Technologies from Microwave to Terahertz Frequencies

Si-based system-in-package design with broadband interconnection for E-band applications

High-Stability Front-End Modules with Directional Filters for W-Band Imaging

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