2006
DOI: 10.1016/j.diamond.2005.09.008
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p-type doping by B ion implantation into diamond at elevated temperatures

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Cited by 15 publications
(8 citation statements)
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“…This is in contrast to the case of boron where the binding energy of a boronvacancy complex is just 1.8 eV, and therefore can be overcome at the annealing temperatures employed [36][37][38][39][40][41][42]. The practical implication is that one will not easily remove implantation damage from material containing impurities such as P and As so that only substitutional impurities remain.…”
Section: Impurity Band Conductionmentioning
confidence: 94%
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“…This is in contrast to the case of boron where the binding energy of a boronvacancy complex is just 1.8 eV, and therefore can be overcome at the annealing temperatures employed [36][37][38][39][40][41][42]. The practical implication is that one will not easily remove implantation damage from material containing impurities such as P and As so that only substitutional impurities remain.…”
Section: Impurity Band Conductionmentioning
confidence: 94%
“…In order to recover the crystalline material high temperature annealing is required. For example, Tsubouchi reports 1450 °C [40,42], and Wu employs annealing at 1700 °C [41]. Furthermore, these temperatures are also employed for indiffusion of boron [45].…”
Section: Electron Affinities and Ionization Energiesmentioning
confidence: 98%
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“…In electronics, diamond is mostly studied for its use as p-and n-type semiconductors. For these purposes, it has been doped with various dopants to create a p-type diamond (doping with boron 2,3 ) or n-type diamond (doping with nitrogen, phosphorus or sulphur 4 ).…”
Section: Introductionmentioning
confidence: 99%
“…For the ion-implantation technique the fluences required usually result in graphitization 11,12 , a process that cannot be reversed 13 . Here, we take advantage of (i) high energy implantation to bury the B layer deep inside the diamond where it is subjected to high internal pressures, keeping the lattice intact even under extreme implantation conditions, (ii) high temperature implantation to promote dynamic annealing during the implantation to inhibit graphitization [14][15][16][17] . Residual damage can then be removed by a post implantation annealing step 18 .…”
Section: Introductionmentioning
confidence: 99%