2007
DOI: 10.1889/1.2785258
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P‐3: Laser Assisted ITO Lift‐off for TFT Fabrication

Abstract: Excimer laser is used for back channel etched (BCE) a-Si TFT fabrication for the first time. KrF laser could easily and successfully lift-off ITO on photo-resist comparing to traditional chemical lift-off process. Besides, this maskless laser lift-off technology could save much process time from mask alignment step. The mechanism of laser assisted ITO lift-off (LAIL) technology was carefully studied in this paper. With suitable laser fluence energy, ITO could be precisely patterned as designed. Very wide range… Show more

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“…3 With an extra quick KrF excimer-laser pulse scanning of the entire TFT glass substrate before chemical stripping, almost all of the ITO film on the P/R surface could be easily lift-off due to the P/R decomposition into gas phase. 3 And the ITO on SiN x , glass and metal pad could still remain due to the larger adhesion force between the ITO and SiN x , ITO, and glass, or ITO to pad metal. The minimum threshold scanning energy to liftoff ITO on P/R is smaller than that to lift-off ITO from other material substrates.…”
Section: Laser-assisted Ito Lift-off (Lail)mentioning
confidence: 99%
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“…3 With an extra quick KrF excimer-laser pulse scanning of the entire TFT glass substrate before chemical stripping, almost all of the ITO film on the P/R surface could be easily lift-off due to the P/R decomposition into gas phase. 3 And the ITO on SiN x , glass and metal pad could still remain due to the larger adhesion force between the ITO and SiN x , ITO, and glass, or ITO to pad metal. The minimum threshold scanning energy to liftoff ITO on P/R is smaller than that to lift-off ITO from other material substrates.…”
Section: Laser-assisted Ito Lift-off (Lail)mentioning
confidence: 99%
“…1 The ITO lift-off technique was recently integrated into a TFT fabrication process to further reduce the photolithography process. 2,3 Through the use of a new pixel structure redesign and by combining the ITO lift-off technology and the SiN x passivation process, we could reduce the two photolithography processes into one. However, compared to the conventional chemical lift-off process, we have to create a reverse-taper structure of a photo-developed P/R such that the P/R stripper could react at this undercutting region to lift-off ITO.…”
Section: Introductionmentioning
confidence: 99%