P‐130: A Proof‐of‐Concept Study for Optimizing Encapsulation Structure for Flexible Electronics Devices Based Novel Thin Gas Barrier Film

Abstract

An optimum encapsulation structure for flexible electronics devices was presented by theoretically and experimentally. Optimum encapsulated test device whose gas barrier layer was located around neutral-axis passed 10,000 cycles of 2 mm radius of curvature bending test. For design of flexible electronics devices, to locate the most fragile layer near neutral-axis is very effective strategy to achieve high flexibility.

22‐3: 5 µm Thickness of Low‐Retardation Plastic Foil with Gas Barrier and Transparent Conductive Layer for Bendable Devices

“…To realize this strategy, the reducing thickness of components is one of the most effective technique because the position of neutral-axis in the device depends on the component thicknesses. We have reported a proof-of-concept study between flexibility and neutral-axis using a 5 μm thickness thinner gas barrier film and verified consistency of this approach [10]. Therefore, thinning of the polymer foil is the key issue to design the flexible electronic device.…”

“…For understanding of foil behavior in the bending test, a tensile stress at a foil surface was calculated based on a laminated beam theory which can be determined from a following equation [10]:…”