1999
DOI: 10.1063/1.370648
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Oxygen precipitation in silicon: Experimental studies and theoretical investigations within the classical theory of nucleation

Abstract: Quantitative measurements of the oxygen precipitate rate as a function of annealing were made in Czochralski-grown silicon wafers that contained different initial concentrations of oxygen. All wafers were annealed at 1000 °C for 15 min to ensure that the initial cluster-size distributions were identical in all samples of the same composition prior to the multi-step annealing treatments used for the precipitation studies. The experimental data are compared with numerical predictions for time-dependent nucleatio… Show more

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Cited by 79 publications
(83 citation statements)
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“…7 reveals the O i concentration in the wafer after TD annihilation rather than the total oxygen concentration. The oxygen particles in the P-band did not dissolve at 800 • C and therefore the oxygen from these particles did not contribute to TD growth at 450 • C. Higher temperature anneal, such as homogenization anneal for 15min at 1000 • C, 17 is required to dissolve grown-in oxide particles and the mapping of the total oxygen concentration could be performed using the same procedure as presented above. As shown in Fig.…”
Section: O I Concentration Mappingmentioning
confidence: 99%
“…7 reveals the O i concentration in the wafer after TD annihilation rather than the total oxygen concentration. The oxygen particles in the P-band did not dissolve at 800 • C and therefore the oxygen from these particles did not contribute to TD growth at 450 • C. Higher temperature anneal, such as homogenization anneal for 15min at 1000 • C, 17 is required to dissolve grown-in oxide particles and the mapping of the total oxygen concentration could be performed using the same procedure as presented above. As shown in Fig.…”
Section: O I Concentration Mappingmentioning
confidence: 99%
“…8 The density of oxide precipitates after 4 h and 16 h nucleation is approximately 5 ϫ 10 8 and 10 10 cm −3 , respectively. 9 In the remainder of the letter, we will refer to these wafer groups as "homogenized", "low BMD", and "high BMD" wafers.…”
mentioning
confidence: 99%
“…The wafer was first annealed at 1230°C to dissolve all oxygen clusters and then subjected to oxygen nucleation treatments at 650°C for 14 h followed by 4 h 800°C and 16 h 1000°C growth steps. Well-defined oxide precipitates, 11 with a density of approximately 5 ϫ10 9 cm Ϫ3 were obtained, which was confirmed by preferential etching and then counting the pits. Based on the density of the oxide precipitates and the decrease in interstitial oxygen concentration, assuming spherical SiO 2 precipitates with oxygen atomic concentration of C p ϭ4.6ϫ10…”
Section: Thermal Stability Of Internal Gettering Of Iron In Silicon Amentioning
confidence: 64%
“…In this set of simulations, the total iron concentration in the sample is set to be 1ϫ10 11 cm Ϫ3 . The initial condition and ramping profiles were the same as in Figs.…”
Section: Thermal Stability Of Internal Gettering Of Iron In Silicon Amentioning
confidence: 99%