Oxygen flow rate effect on copper oxide thin films deposited by radio frequency magnetron sputtering

Tadjine, R.; Houimi, Amina; Alim, Mohamed Mounes; Oudini, N.

doi:10.1016/j.tsf.2021.139013

Cited by 18 publications

(3 citation statements)

References 35 publications

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“…Copper oxide (CuO) is considered a suitable material as the anti-reflection (AR) layer due to its black color. − By tuning the morphology of the AR layer or the interface layer, the adhesion of the AR layer to the substrate could be slightly improved. ,,, However, the low resistance of CuO to etching of the chemical solution during planarization is another issue . Nickel (Ni)-contained species exhibit better resistance to chemical corrosion and show improved adhesion to PI that are also considered potential AR materials. − …”

Section: Introductionmentioning

confidence: 99%

“…Copper oxide (CuO) is considered a suitable material as the anti-reflection (AR) layer due to its black color. 7 − 9 By tuning the morphology of the AR layer or the interface layer, the adhesion of the AR layer to the substrate could be slightly improved. 4 , 6 , 10 , 11 However, the low resistance of CuO to etching of the chemical solution during planarization is another issue.…”

Section: Introductionmentioning

confidence: 99%

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Anti-reflection Layer-Sputtered Transparent Polyimide Substrate with Reliable Adhesion Strength to the Copper Layer

et al. 2023

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Parameters of DC-reactive magnetron sputtering are optimized to deposit anti-reflection (AR) layers on transparent polyimide (PI) substrates, followed by the deposition of the conductive copper layer, to fabricate practically reliable composite films as advanced flexible circuits. When the deposition thickness is controlled and the gas composition during sputtering is adjusted, the resultant AR layer-coated PI film exhibits low reflectance and reveals improved adhesion strength to the copper layer. The adhesion reliability tests confirm that the peel strength between the PI film and the deposited layers could be further improved after thermal processing due to the formation of a worm-like morphology for better mechanical interlocking with layers. The facile sputtering process successfully fabricates a reliable substrate material with low reflectance and sufficient adhesion strength to copper for application as flexible printed circuits.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Anti-reflection Layer-Sputtered Transparent Polyimide Substrate with Reliable Adhesion Strength to the Copper Layer

et al. 2023

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“…Regarding the physical ones, sputtering is one of the most popular physical vapour deposition (PVD) methods used to fabricate films of metals, alloys, oxides, and nitrides [28][29][30][31]. Since the pioneering work of Terada et al (1989) on epitaxial growth of copper nitride [32], reactive RF magnetron sputtering has become the most widely used mode for the fabrication of binary nitride.…”

Section: Introductionmentioning

confidence: 99%

Copper Nitride: A Versatile Semiconductor with Great Potential for Next-Generation Photovoltaics

et al. 2023

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Copper nitride (Cu3N) has gained significant attention recently due to its potential in several scientific and technological applications. This study focuses on using Cu3N as a solar absorber in photovoltaic technology. Cu3N thin films were deposited on glass substrates and silicon wafers via radio-frequency magnetron sputtering at different nitrogen flow ratios with total pressures ranging from 1.0 to 5.0 Pa. The thin films’ structural, morphology, and chemical properties were determined using XRD, Raman, AFM, and SEM/EDS techniques. The results revealed that the Cu3N films exhibited a polycrystalline structure, with the preferred orientation varying from 100 to 111 depending on the working pressure employed. Raman spectroscopy confirmed the presence of Cu-N bonds in characteristic peaks observed in the 618–627 cm−1 range, while SEM and AFM images confirmed the presence of uniform and smooth surface morphologies. The optical properties of the films were investigated using UV-VIS-NIR spectroscopy and photothermal deflection spectroscopy (PDS). The obtained band gap, refractive index, and Urbach energy values demonstrated promising optical properties for Cu3N films, indicating their potential as solar absorbers in photovoltaic technology. This study highlights the favourable properties of Cu3N films deposited using the RF sputtering method, paving the way for their implementation in thin-film photovoltaic technologies. These findings contribute to the progress and optimisation of Cu3N-based materials for efficient solar energy conversion.

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Influence of power and duration on RF sputtering for the formation of terbium oxide passivation layers via the argon ambient

Sifawa,

Mohammad,

Muhammad

et al. 2024

J Mater Sci: Mater Electron

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Oxygen flow rate effect on copper oxide thin films deposited by radio frequency magnetron sputtering

Cited by 18 publications

References 35 publications

Anti-reflection Layer-Sputtered Transparent Polyimide Substrate with Reliable Adhesion Strength to the Copper Layer

Anti-reflection Layer-Sputtered Transparent Polyimide Substrate with Reliable Adhesion Strength to the Copper Layer

Copper Nitride: A Versatile Semiconductor with Great Potential for Next-Generation Photovoltaics

Influence of power and duration on RF sputtering for the formation of terbium oxide passivation layers via the argon ambient

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