We have studied a process for filling narrow spaces between adjacent metallic conductors (gaps). The process consists of cycles of deposition of
SiO2
by plasma‐enhanced chemical vapor deposition (PECVD) and sputter etching in Ar. For a fixed process and metal thickness, as the gaps decrease in size, i.e., as the aspect ratio,
ARfalse(AR=normalmetal height/normalspace widthfalse)
increases, a region which etches rapidly in a
normalbuffered‐HF
solution (BHF) is formed in the gap. At higher values of AR, physical voids are formed. The ability to fill the gaps with ‘good’ quality oxide is a function not only of AR but of the side‐wall angle and the thickness of the metal as well. Filaments of an unidentified material can also be detected within the gap. Higher AR spaces can be filled if more of the oxide is sputtered. However, decreasing the thickness of the PECVD film deposited before etch‐back, or using
O2
instead of Ar, has the opposite effect. The material in the gap which has a high etch rate in BHF does not etch at a higher rate in a
CF4
plasma; therefore, misalignment of vias is not a concern unless physical voids have been formed. The dielectric constant of the PECVD
SiO2
is unchanged by sputter etching; the break‐down strength of the oxide is degraded. However, after the structure is completed by the deposition of a thick PECVD layer, the effect of the dep/etch cycles on the break‐down strength of the composite is not detectable.