Oxidation of Au4Al in gold ballbonds

Phase formation of nanolaminated Mo2AuC and Mo2(Au1−xGax)2C by a substitutional reaction within Au-capped Mo2GaC and Mo2Ga2C thin films

“…36 be due to a too small amount of Al, and oxidation of the intermediate phase. 37,38 Step (2) in the reaction has an interdependent driving force with step (1). That is, to equilibrate the chemical potential of Ga and Au in the nanolaminates and the capping layer by replacing the vacancies in the A layers with Au atoms.…”

Oxidation study on as-bonded intermetallic of copper wire–aluminum bond pad metallization for electronic microchip

“…K&S Ò 8082PPS in Ref. [14] and ASM Ò Eagle 60 in [2] and are equipped with transducer that are capable to generate 120 and 138 kHz [17] ultrasonic frequency, respectively. However, older model Shinkawa Ò ACB35 wire bonder used in this work is capable to generate only 60 kHz ultrasonic frequency.…”

Interface microstructure effects in Au thermosonic ball bonding contacts by high reliability wire materials

“…In particular Au 4 Al formation occurring after prolonged aging times at increased temperatures is related to weakening of the wire bond interconnection due to lift offs caused by voiding or corrosive effects [11]. With respect to affecting phase formation sequences (v) using high reliability wires doped with Pd or Pt and Cu did not suppress formation of these Au 4 Al intermetallics nor were even dopants found to be incorporated into its structure.…”