“…Using plasma‐enhanced ALD, ultra‐thin SiO x , SiN x , AlO x , AlN x , and TiO x interlayers were deposited either on top of the conventional thermally‐grown SiO x or on hydrofluoric acid (HF) dipped silicon wafers at different deposition (substrate) temperatures in a FlexAL system from Oxford Instruments. As precursors, bis (diethylamino)silane (BDEAS) for SiO x 37–40 and SiN x, 41 trimethylaluminium (TMA) for AlO x 42–44 and AlN x, 45,46 and titanium isopropoxide (TTIP) for TiO x 47 were used together with oxygen (O 2 ), nitrogen (N 2 ), or nitrogen(N 2 )/hydrogen (H 2 ) plasma gases for SiO x , AlO x and TiO x, SiN x , and AlN x , respectively.…”