2008
DOI: 10.1063/1.3013821
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Origin of highly spatially selective etching in deeply implanted complex oxides

Abstract: Effects of substrate temperature and annealing temperature on the formation and properties of erbium silicide layers synthesized by high current Er ion implantation J. Appl. Phys. 94, 157 (2003); 10.1063/1.1573346 Characterization of hydrogen etched 6H-SiC(0001) substrates and subsequently grown AlN films

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Cited by 19 publications
(5 citation statements)
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“…2(a) and 2(b) are obtained after lowtemperature annealing; the restoration of the signal toward that of the virgin sample shows that the irradiation damage can be, in part, removed by annealing. Annealing-induced "repair" of irradiation damage of LiNbO 3 has been reported extensively in previous measurements [19,20]. In part this "repair" is due to diffusive dissipation of interstitial He in a heated crystal.…”
Section: Resultsmentioning
confidence: 80%
“…2(a) and 2(b) are obtained after lowtemperature annealing; the restoration of the signal toward that of the virgin sample shows that the irradiation damage can be, in part, removed by annealing. Annealing-induced "repair" of irradiation damage of LiNbO 3 has been reported extensively in previous measurements [19,20]. In part this "repair" is due to diffusive dissipation of interstitial He in a heated crystal.…”
Section: Resultsmentioning
confidence: 80%
“…Note that prior literature results also suggest that the involvement of different defect-generation mechanisms such as using light-ion or swift heavy-ion irradiation may result in somewhat different etching results. For example, an etching rate of $3.2 ± 0.3 lm/min in He + -irradiated LiNbO 3 after thermal activation was reported [12].…”
Section: Resultsmentioning
confidence: 97%
“…In LiNbO 3 , these defects manifest themselves as a striking series of lines at the surface arranged parallel to the threefold lattice-symmetry planes. In addition, the density of these extended defects reaches a maximum after thermally activated dislocation motion, activated during annealing at $250°C [12]. The existence of these local defect networks enhances an anomalously high selective etch rate ($lm/ min) [12]; this rate is $10 3 Â greater than the etch rate in the remainder of the sample.…”
Section: Resultsmentioning
confidence: 98%
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“…Subsequently the samples were annealed at 250°C for 30 minutes for thermal activation and then placed in a ~5% hydrofluoric (HF) acid etching bath for several hours. Because of the high etch selectivity in the buried sacrificial layer [16], the etching results in exfoliation of a ~10 μmthick single-crystal-LN film. Post lift-off annealing (PLA) was then carried out in a furnace at 600°C for 10 hours in a laboratory-atmosphere ambient to remove any residual stress [17].…”
Section: Experimental and Resultsmentioning
confidence: 99%