Colloidal lithography is a cost-efficient
method to produce large-scale
nanostructured arrays on surfaces. Typically, colloidal particles
are assembled into hexagonal close-packed monolayers at liquid interfaces
and deposited onto a solid substrate. Many applications, however,
require non close-packed monolayers, which are more difficult to fabricate.
Preassembly at the oil/water interface provides non close-packed colloidal
assemblies but these are difficult to transfer to a solid substrate
without compromising the ordering due to capillary forces acting upon
drying. Alternatively, plasma etching can reduce a close-packed monolayer
into a non close-packed arrangement, however, with limited interparticle
distance and compromised particle shape. Here, we present a simple
alternative approach toward non close-packed colloidal monolayers
with tailored interparticle distance, high order, and retained spherical
particle shape. We preassemble poly(N-isopropylacrylamide)-silica
(SiO2@PNiPAm) core–shell particles at the air/water
interface, transfer the interfacial spacer to a solid substrate, and
use the polymer shell as a sacrificial layer that can be thermally
removed to leave a non close-packed silica monolayer. The shell thickness,
cross-linking density, and the phase behavior upon compression of
these complex particles at the air/water interface provide parameters
to precisely control the lattice spacing in these surface nanostructures.
We achieve hexagonal non close-packed arrays of silica spheres with
interparticle distances between 400 and 1280 nm, up to 8 times their
diameter. The retained spherical shape is advantageous for surface
nanostructuring, which we demonstrate by the fabrication of gold nanocrescent
arrays via colloidal lithography and silicon nanopillar arrays via
metal-assisted chemical etching.