Organic Dielectric Materials with Reduced Moisture Absorption and Improved Electrical Properties

Goff, David L.; Yuan, E. L.; Huang, Long; Neuhaus, Herbert J.

doi:10.1021/bk-1989-0407.ch008

Cited by 13 publications

(8 citation statements)

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“…Polyimides with a low dielectric constant, low refractive index, low water absorption, and a low coefficient of thermal expansion are being explored for interlayer dielectrics in electronic devices such as integrated circuits. [2] The main drawbacks of these classes of polymers are their insolubility and intractability, which causes difficulties in both synthesis and processing. Therefore, the processing of the polyimides is generally carried out via soluble poly(amic acid) precursors, which are cast onto a glass plate and then converted into thin polyimide films by a rigorous thermal treatment.…”

Section: Introductionmentioning

confidence: 99%

Novel Semi‐Fluorinated Poly(ether imide)s Derived From 4‐(p‐Aminophenoxy)‐3‐trifluoromethyl‐4′‐aminobiphenyl

Kute

Banerjee

2003

Macro Chemistry & Physics

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An unsymmetrical diamine monomer 4‐(p‐aminophenoxy)‐3‐trifluoromethyl‐4′‐aminobiphenyl has been synthesized successfully. This monomer leads to the synthesis of different novel poly(ether imide)s when reacted with different dianhydrides like pyromellatic dianhydride (PMDA), benzophenone tetracarboxylic acid dianhydride (BTDA), 2,2‐bis(3,4‐dicarboxyphenyl) hexafluoropropane (6FDA), and oxy diphthalic anhydride (ODA). The poly(ether imide) prepared from this monomer on reaction with 6FDA is soluble in several organic solvents such as N‐methylpyrolidinone (NMP), dimethylformamide (DMF), N,N‐dimethylacetamide (DMAc), tetrahydrofuran (THF), and CHCl3. The poly(ether imide)s prepared from BTDA and ODA are soluble in NMP, DMF, and DMAc but not in THF or CHCl3, whereas the polymer prepared from PMDA is soluble only in NMP. The water uptake value for these poly(ether imide) films is very low (0.2–0.5%), and exhibited low dielectric constants (2.81 at 1 MHz). The polymers exhibited high thermal stability up to 532 °C in air for 5% weight loss, and high glass transition temperatures up to 288 °C. The polymer exhibited high tensile strength up to 135 MPa, modulus 3.2 GPa, and elongation at break up to 25%, depending on the exact polymer structure.The structure of the poly(ether imide) synthesised from 4‐(p‐aminophenoxy)‐3‐trifluoromethyl‐4′‐aminobiphenyl and 2,2‐bis(3,4‐dicarboxyphenyl) hexafluoropropane. This polymer was soluble in many organic solvents.magnified imageThe structure of the poly(ether imide) synthesised from 4‐(p‐aminophenoxy)‐3‐trifluoromethyl‐4′‐aminobiphenyl and 2,2‐bis(3,4‐dicarboxyphenyl) hexafluoropropane. This polymer was soluble in many organic solvents.

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Section: Introductionmentioning

confidence: 99%

Novel Semi‐Fluorinated Poly(ether imide)s Derived From 4‐(p‐Aminophenoxy)‐3‐trifluoromethyl‐4′‐aminobiphenyl

Kute

Banerjee

2003

Macro Chemistry & Physics

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“…Polyimides are of great interest because they exhibit a number of outstanding properties such as excellent thermal stability in air, solvent resistance, and mechanical and electrical properties 1–12. These materials have been considered for use in numerous applications that require robust organic materials including composites and precursors for high‐performance aerospace materials as well as membranes for gas separation 11.…”

Section: Introductionmentioning

confidence: 99%

“…These materials have been considered for use in numerous applications that require robust organic materials including composites and precursors for high‐performance aerospace materials as well as membranes for gas separation 11. Polyimides with low dielectric constants, low refractive indices, low water absorption, and low coefficients of thermal expansion are receiving interest for interlayer dielectrics in electronic devices such as integrated circuits 4, 7, 12…”

Section: Introductionmentioning

confidence: 99%

“…Incorporation of these groups serves to increase the free volume of the polyimides, thereby improving various properties including solubility and electrical insulating properties, without forfeiture of thermal stability 75, 87. These groups also reduce water absorption,7, 83 crystallinity, and color,87 whereas they increase flame resistance,75 gas permeabilities,11 and optical transparency 4, 74…”

Section: Introductionmentioning

confidence: 99%

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Synthesis and properties of fluorinated polyimides. 1. Derived from novel 4,4″‐bis(aminophenoxy)‐3,3″‐trifluoromethyl terphenyl

Banerjee

Madhra

Salunke

et al. 2002

J. Polym. Sci. A Polym. Chem.

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A new diamine monomer, 4,4″‐bis(aminophenoxy)‐3,3″‐trifluoromethyl terphenyl (ATFT) was synthesized that led to a number of novel fluorinated polyimides by solution as well as thermal imidization routes when reacted with different commercially available dianhydrides like pyromellatic dianhydride (PMDA), benzophenone tetracarboxylic acid dianhydride (BTDA), or 2,2‐bis(3,4‐dicarboxyphenyl) hexafluoropropane (6FDA). The polyimides ATFT/BTDA and ATFT/6FDA derived from both routes were soluble in several organic solvents such as N,N‐dimethylformamide, N,N‐dimethylacetamide, and dimethyl sulfoxide. The polyimide ATFT/PMDA was only soluble in N‐methylpyrollidone. The polyimide films had low water absorption of 0.3–0.7%, low dielectric constants of 2.72–3.3 at 1 Hz, refractive indices of 1.594–1.647 at 589.3 nm, and optical transparency >85%. These polyimides showed very high thermal stability with decomposition temperatures (5% weight loss) up to 532 °C in air and good isothermal stability; only 7% weight loss occurred at 400 °C after 7 h, and less than 0.6% weight loss was observed at 315 °C for 5 h. Transparent thin films of these polyimides exhibited tensile strengths up to 112 MPa, a modulus of elasticity up to 3.05 GPa, and elongation at break up to 21% depending on the repeating unit structure. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 1016–1027, 2002

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“…The coefficient of thermal expansion of polyimide is related to the linearity of polymer molecular skeletons, thus many researchers have attempted to modify the polymer backbone to reduce the coefficient of thermal expansion, such as incorporating fluorine into the polymer backbone . However, the incorporation of fluorine into polyimide degrades the mechanical properties of polyimide significantly . Compared with other types of polymers, polyimide absorb much more moisture, for example, the typical saturated moisture absorption of polyimide can be as high as 4.4%, which is considerably higher than epoxy (1.5%) and PEEK (0.5%) .…”

Section: Introductionmentioning

confidence: 99%

Tribological properties of nanoclay reinforced polyimide nanocomposite coatings for alloy steels

Meng

2017

Int J Applied Ceramic Tech

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A new process was developed to deposit uniform Montmorillonite nanoclay reinforced polyimide nanocomposite coating on alloy steels. The nanoclay particles were successfully dispersed in N, N-Dimethylacetamide using a combination of magnetic stirring, soaking, and ultrasonic agitation. It was found that the uniform and crack-free coating can be achieved. The tribological tests indicated that the nanocomposite coating has good adhesion to alloy steels, good load carrying capacity, relatively low friction, and wear. This nanocomposite is a promising material for some offshore, aerospace, and automotive structures that are subjected to sliding contact in corrosive environment

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Organic Dielectric Materials with Reduced Moisture Absorption and Improved Electrical Properties

Cited by 13 publications

References 0 publications

Novel Semi‐Fluorinated Poly(ether imide)s Derived From 4‐(p‐Aminophenoxy)‐3‐trifluoromethyl‐4′‐aminobiphenyl

Novel Semi‐Fluorinated Poly(ether imide)s Derived From 4‐(p‐Aminophenoxy)‐3‐trifluoromethyl‐4′‐aminobiphenyl

Synthesis and properties of fluorinated polyimides. 1. Derived from novel 4,4″‐bis(aminophenoxy)‐3,3″‐trifluoromethyl terphenyl

Tribological properties of nanoclay reinforced polyimide nanocomposite coatings for alloy steels

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