“…Regarding the second set of challenges, one may mention the expected progress in microfabrication processes and materials, which can contribute to decrease costs and make high-volume industrial applications accessible, to develop new opto-electromechanical or biological functionalities to the microcantilever, or even allow the integration of sensors in curvilinear or complex three-dimensional (3D)-shaped surfaces. New geometries have started to emerge thanks to the enhanced fabrication techniques that are available today-see, for example, hollow cantilevers [135] or probes with integrated fibre optics for sensing [136]. Additionally, interfacing the beam with a proper circuitry, and integration with complementary metal-oxide-semiconductor (CMOS), is equally a crucial step for any commercial applications that will allow us to probe higher frequencies and ever-reducing time and space scales, in real-time, contributing actively to the promised next revolution of smart cities/homes and the Internet of Things (IoT), where common spaces can be filled with sensing devices that continuously monitor the environment and communicate with one another or with people.…”