Optimum process parameters for ultrasonic consolidation of 3003 aluminium

Kong, C.Y.; Soar, Rupert; Dickens, Phill

doi:10.1016/j.jmatprotec.2003.10.016

Cited by 147 publications

(113 citation statements)

References 4 publications

(4 reference statements)

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“…The sonotrode is then rolled over the foil with a linear speed (S), while it oscillates at an ultrasonic frequency (20 kHz) at a pre-set amplitude (A) perpendicular to the direction of rolling. This process causes the mating surfaces at the foilfoil interface to come in close metal contact and form solid state metal bonds [3,4].…”

mentioning

confidence: 99%

The Effect of Ultrasonic Additive Manufacturing on Integrated Printed Electronic Conductors

Bournias-Varotsis

Wang

Hutt

et al. 2018

Electron. Mater. Lett.

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Ultrasonic additive manufacturing (UAM) is a low temperature manufacturing method capable of embedding printed electronics in metal components. The effect of UAM processing on the resistivity of conductive tracks printed with five different conductive pastes based on silver, copper or carbon flakes/particles in either a thermoplastic or thermoset filler binder are investigated. For all but the carbon-based paste, the resistivity changed linearly with the UAM energy input. After UAM processing, a resistivity increase of more than 150 times was recorded for the copper based thermoset paste. The silver based pastes showed a resistivity increase of between 1.1 and 50 times from their initial values. The carbon-based paste showed no change in resistivity after UAM processing. Focussed ion beam microstructure analysis of the printed conductive tracks before and after UAM processing showed that the silver particles and flakes in at least one of the pastes partly dislodged from their thermoset filler creating voids, thereby increasing the resistivity, whereas the silver flakes in a thermoplastic filler did not dislodge due to material flow of the polymer binder. The lowest resistivity (8 × 10 −5 Ω cm) after UAM processing was achieved for a thermoplastic paste with silver flakes at low UAM processing energy. Graphical Abstract

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mentioning

confidence: 99%

The Effect of Ultrasonic Additive Manufacturing on Integrated Printed Electronic Conductors

Bournias-Varotsis

Wang

Hutt

et al. 2018

Electron. Mater. Lett.

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“…The complexity brought about by the powder phase change and the corresponding variation of the thermal properties during SLM also complicate the heat transfer problem. A detailed literature survey describing the heat transfer problem in SLM can be found in [45]. 15 …”

Section: Slm Thermal Simulationsmentioning

confidence: 99%

“…16 Figure 3 Schematic of UC process [44] The primary process parameters in UC fabrications are vibration amplitude, temperature, welding speed, and normal force [45]. Other parameters that can affect weld quality include welding sonotrode surface roughness, foil surface finish [46], and how much "overlap" is used between adjacent foils when using the automated material feed system [47].…”

Section: Ultrasonic Consolidationmentioning

confidence: 99%

“…The next subsection describes a special class of dynamic problems where refinement, de-refinement and data transfer is required frequently. 45 1.4.1 Literature on dynamic adaptive mesh generation "Dynamic adaptive meshing" has been used for various types of adaptive meshing strategies which involve meshing adaptively for dynamic boundary conditions or response evolution. A dynamically adaptive mesh [96] has been prepared with the help of a moving mesh strategy involving solution of Variational equations derived for moving mesh generation.…”

Section: Adaptive Meshing In Dynamic Problems and Data Transfer Betwementioning

confidence: 99%

“…An assumption for continuously spatio-temporal periodic problems in time is given in equation 45. Metal laser sintering is an additive manufacturing process in which the surface of a powder bed is melted layer by layer to create a 3D part with complex geometry.…”

Section: Spatio-temporal Periodic Problems and Metal Laser Sinteringmentioning

confidence: 99%

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Optimum process parameters for ultrasonic consolidation of 3003 aluminium

Cited by 147 publications

References 4 publications

The Effect of Ultrasonic Additive Manufacturing on Integrated Printed Electronic Conductors

The Effect of Ultrasonic Additive Manufacturing on Integrated Printed Electronic Conductors

A novel numerical framework for simulation of multiscale spatio-temporally non-linear systems in additive manufacturing processes.

Micro‐Layered Manufacturing

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