“…By performing a series of experiments with hydrophobic Zn(Ln)S [Ln = Eu, Tb], 32 II-VI sulfides and selenides, 32 Zn(Tb)S NPs of varying size, 33 hydrophilic Zn(Ln)S [Ln = Sm, Eu, Tb, Dy] NPs, 34 Ti(Ln)O 2 [Ln = Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb] NPs, 55 near band gap-matched Sn(Ln)O 2 and Zn(Ln)S [Ln = Sm, Tb] NPs, 30 Sn(Ln)O 2 [Ln = Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb] NPs, 56 ZnS/Ln and CdSe/Ln [Ln = Pr, Nd, Sm, Eu, Tb, Dy, Ho, Er, Tm, Yb] NPs, 36 and alloyed Zn 1Àx Cd x (Tb)S NPs, 25 we have argued that Ln 3+ emission sensitization in semiconductor NPs operates through a charge trapping-mediated photophysical pathway; in this process, the spectral overlap between the donor NP emission and acceptor Ln 3+ absorption is insignificant. 28,30,32,33 In the charge trapping-mediated dopant emission sensitization process, the Ln 3+ ground and luminescent energy levels need to be optimally placed above and below the valence and conduction band of the host material, respectively, to ensure the efficient colocalization of photogenerated holes and electrons at the Ln 3+ -related trap site. Subsequent electron-hole pair recombination at the Ln 3+ trap site populates the dopant luminescent energy level, thus generating the host-sensitized dopant emission from the composite doped NP assemblies.…”