Optimizing Grain Structure and Enhancing Mechanical Properties in Sub-Micro Sn-Ag Solder Joints Via Doping Zn and Ni in Cu Substrates

LEE, Yin-Ku; Wu, Zih-You; Huang, Pin-Wei; Tsai, Su-Yueh; Chang, Shou-Yi; Duh, Jenq Gong

doi:10.2139/ssrn.4380125

2023

DOI: 10.2139/ssrn.4380125

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Optimizing Grain Structure and Enhancing Mechanical Properties in Sub-Micro Sn-Ag Solder Joints Via Doping Zn and Ni in Cu Substrates

Yin-Ku LEE

Zih-You Wu

Pin-Wei Huang

et al.

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Optimizing Grain Structure and Enhancing Mechanical Properties in Sub-Micro Sn-Ag Solder Joints Via Doping Zn and Ni in Cu Substrates

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