Optimizing gold thickness of land grid array pads for cost, performance and reliability of connectors

Meyyappan, Karumbu; Kurella, Anil; Pathangey, B.; McAllister, Alan; Abraham, Amit; Murtagian, Gregorio

doi:10.1109/holm.2014.7031070

Cited by 4 publications

(3 citation statements)

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“…These dimensions are significantly larger than what is anticipated in semiconductor applications. [ 2 ] Additionally, the study does not address the electrical property changes or strength changes as a result of the IMC formation. Other studies in the past have included gallium interaction with various metal substrates including Cu, Ni, NiTi, Al, and stainless steel at higher temperatures.…”

Section: Review Of Gallium‐based Reliability Riskmentioning

confidence: 99%

“…Figure shows a schematics of a typical stack used in semiconductor packaging for second‐level interconnect, showing the various layers. [ 2 ] Copper, the base metal, is an excellent conductor and forms the traces and the pads. However, copper oxidizes immediately and is also prone to creep corrosion in the presence of moisture and corrosive gas.…”

Section: Review Of Gallium‐based Reliability Riskmentioning

confidence: 99%

“…The LGA technologies are predominantly used today in desktop systems and servers where right to repair and inventory management is critical. LGA technologies are electrically conductive mechanical springs that need to be compressed for the springs to come in contact with the LGA pads, [ 2 ] and are sensitive to warpage and load. [ 3 ] BGA connections, on the other hand, are insensitive to load, offer low Z‐height, and significantly lower package‐to‐board resistance compared to a socket.…”

Section: Introductionmentioning

confidence: 99%

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Field Risk Evaluation of Liquid Metal Interconnects in Microelectronics Applications

Meyyappan,

Murtagian,

Tadayon

et al. 2023

Adv Eng Mater

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Gallium is one of the most desirable, yet less known, interconnects considered in the semiconductor industry. Good electrical conductivity and high stretchability of the liquid metal makes it very attractive for many applications. It allows components to be assembled or disaggregated like Lego blocks without any external forces or energy. The focus of this paper is to shed light on intrinsic reliability degradation mechanisms for components that use liquid metal interconnects. As a starting reference to field reliability risk evaluations, the authors focus on common/controlled use conditions. Environments studied include standard test evaluation procedures like thermal aging (sustained exposure to high temperature over time), thermal cycling, current carrying capability and finally functional product life cycle testing. Studies reveal that the interconnect has very distinct failure mechanisms and unique advantageous/disadvantageous over existing interconnects. Fundamental knowledge gained in this study is expected to help 1) drive future architectures, 2) material/design changes to address any limitations and 3) lastly new qualification methods/standards that account for the unique failure mechanisms.This article is protected by copyright. All rights reserved.

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Section: Review Of Gallium‐based Reliability Riskmentioning

confidence: 99%

Section: Review Of Gallium‐based Reliability Riskmentioning

confidence: 99%