2014 IEEE 60th Holm Conference on Electrical Contacts (Holm) 2014
DOI: 10.1109/holm.2014.7031071
|View full text |Cite
|
Sign up to set email alerts
|

Fundamentals based approach to predict socket stack performance

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2014
2014
2023
2023

Publication Types

Select...
2
1

Relationship

0
3

Authors

Journals

citations
Cited by 3 publications
(1 citation statement)
references
References 12 publications
0
1
0
Order By: Relevance
“…LGA technologies are electrically conductive mechanical springs that need to be compressed for the springs to come in contact with the LGA pads, [ 2 ] and are sensitive to warpage and load. [ 3 ] BGA connections, on the other hand, are insensitive to load, offer low Z‐height, and significantly lower package‐to‐board resistance compared to a socket.…”
Section: Introductionmentioning
confidence: 99%
“…LGA technologies are electrically conductive mechanical springs that need to be compressed for the springs to come in contact with the LGA pads, [ 2 ] and are sensitive to warpage and load. [ 3 ] BGA connections, on the other hand, are insensitive to load, offer low Z‐height, and significantly lower package‐to‐board resistance compared to a socket.…”
Section: Introductionmentioning
confidence: 99%