Optimizing FIB milling process parameters for silicon and its use in nanoreplication

Goswami, Arjyajyoti; Singh, Kumar Vikram; Aravindan, S.; Rao, P. Venkateswara

doi:10.1080/10426914.2016.1257127

Cited by 8 publications

(1 citation statement)

References 26 publications

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“…Single crystal silicon (SCS) has been the preferred substrate material for more than the last four decades for realizing miniature sensors and actuators. However, silicon micro-technology [1][2][3] suffers from the following limitations: (i) cost-intensive clean room environment that requires not only a very high installation cost but also a high running and maintenance cost, (ii) costly equipment required for pattern transfer using lithography, physical and chemical deposition techniques, and dry etching steps, and (iii) requirement of hazardous chemicals and costly carrier gases. These cost-related issues of silicon technology, coupled with an increasing awareness of the cost-to-performance ratio amongst the researchers, pushed the quest for low-cost processes and materials to realize miniature devices.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of micro-mechanical planar cantilever beam-mass structures on quartz substrates using an ECDM process

Sambathkumar

Sankar

2021

Proceedings of the Institution of Mechanical Engineers, Part B:

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Electrochemical discharge machining (ECDM) processes have been used to realize miniature structures such as micro-channels and micro-holes on non-conductive materials such as quartz and Pyrex for a variety of applications. However, for realizing mechanical/physical sensors, actuators, energy harvesters, and resonators on glass substrates, free-standing devices with movable components such as beam-mass structures and cantilevers are required. There has been a negligible focus on developing miniature glass-based devices with movable components primarily due to the non-linear material removal rate (MRR) of the ECDM processes, requiring continuous measurement, tracking, and maintaining the working gap in the range of a few micrometers during micromachining. A couple of techniques were proposed to address maintaining a constant working gap, however, using costly equipment with complex feedback mechanisms. We report a two-stage experimental approach – without using feedback mechanisms and additional equipment – to realize micro-mechanical planar cantilever beam-mass structures on thick quartz substrates in the present work. In the first stage, the process parameters such as applied voltage, tool travel rate (TTR), and initial working gap ( Wg) are optimized for fabricating broader and deeper micro-channels using needle-shaped tools. In the second stage, using the optimized parameters, an array of micro-channels is fabricated. The cumulative depth, corresponding depth, and the width of each layer of the channels are measured, and this data is utilized for fabricating planar beam-mass structures on quartz substrates. We envisage that the experimental results of the present study would be beneficial for ECDM researchers to fabricate glass-based miniature devices with movable components without using complex tools and equipment.

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Section: Introductionmentioning

confidence: 99%

Fabrication of micro-mechanical planar cantilever beam-mass structures on quartz substrates using an ECDM process

Sambathkumar

Sankar

2021

Proceedings of the Institution of Mechanical Engineers, Part B:

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Surface Micromachining—Advances and Advanced Characterization Techniques

Goswami

2020

Lecture Notes in Mechanical Engineering

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Non-traditional machining techniques for silicon wafers

Daud

Hasan

Saleh

et al. 2022

Int J Adv Manuf Technol

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Silicon (Si) micromachining techniques have recently witnessed significant advancement, attributable to the high surge in demand for microelectromechanical and microelectronic devices. Micromachining techniques are widely used to cut or pattern Si, in order to obtain high-quality surface finishes for the fabrication of devices. Micromachining techniques are used for the fabrication of three-dimensional (3D) microstructures for microelectromechanical devices. In this work, the capabilities and competencies of non-traditional Si micromachining techniques, including ultrasonic, ion beam milling, laser machining, and electrical discharge machining, are discussed and compared accordingly. The working principles, advantages, limitations, and Si microstructures that have been fabricated before are discussed in detail. Additionally, this work covers the performance reported by multiple researchers on these micromachining methods, spanning the temporal range of 1990 to 2020. The key outcomes of this study are explored and summarized.

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Optimizing FIB milling process parameters for silicon and its use in nanoreplication

Cited by 8 publications

References 26 publications

Fabrication of micro-mechanical planar cantilever beam-mass structures on quartz substrates using an ECDM process

Fabrication of micro-mechanical planar cantilever beam-mass structures on quartz substrates using an ECDM process

Surface Micromachining—Advances and Advanced Characterization Techniques

Non-traditional machining techniques for silicon wafers

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