Optimized Stress Testing for Flexible Hybrid Electronics Designs

Gao, Hang; Bhat, Ganapati; Ogras, Ümit Y.; Ozev, Sule

doi:10.1109/vts.2019.8758661

Cited by 3 publications

(1 citation statement)

References 22 publications

(4 reference statements)

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“…Besides, niche applications such as electronic skin for robotics as well as prosthetics [12][13][14][15] and ultra-thin IC packages [16][17][18] for miniaturized electronic packages could also benefit from FHE. Recent advances in FHE are very promising [19][20][21][22][23][24][25] and therefore, FHE is expected to play a vital role in further developments of these applications. Furthermore, low cost production of FHE components such as chip-foil packages for these applications could be achieved by implementing roll-to-roll (R2R) manufacturing processes [26].…”

Section: Introductionmentioning

confidence: 99%

Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics

et al. 2020

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The growing interest towards thinner and conformable electronic systems has attracted significant attention towards flexible hybrid electronics (FHE). Thin chip-foil packages fabricated by integrating ultra-thin monocrystalline silicon integrated circuits (ICs) on/in flexible foils have the potential to deliver high performance electrical functionalities at very low power requirements while being mechanically flexible. However, only very limited information is available regarding the fatigue or dynamic bending reliability of such chip-foil packages. This paper reports a series of experiments where the influence of the type of metal constituting the interconnects on the foil substrates on their dynamic bending reliability has been analyzed. The test results show that chip-foil packages with interconnects fabricated from a highly flexible metal like gold endure the repeated bending tests better than chip-foil packages with stiffer interconnects fabricated from copper or aluminum. We conclude that further analysis work in this field will lead to new technical concepts and designs for reliable foil based electronics.

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Section: Introductionmentioning

confidence: 99%

Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics

et al. 2020

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Hybrid chips to enable a sustainable internet of things technology: opportunities and challenges

Rogdakis,

Psaltakis,

Fagas

et al. 2024

Discov Mater

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A new technological approach is needed for the development of emerging electronic components and systems within the Internet of Things (IoT) era. New advancements and innovations are required in architectural design and hybrid systems heterogeneous integration to address the challenge of widespread IoT deployment, its power demands and sustainability. Hybrid chips are one of the emerging technologies that can help overcome the current limitations in terms of energy consumption, performance and sustainability that could shape the future of electronic systems for targeted applications. Hybrid chips combine different materials and manufacturing technologies on the same substrate or package using advanced flexible heterogeneous integration techniques, with the focus of merging the advantages of each unit or technology toward enhanced performance and new levels of emerging functionalities. The categorization of hybrid chips spans across rigid hybrid chips that follow a multi-chiplet approach, semi-flexible chips that integrate flexible units with semi-rigid ones such as thinned silicon integrated circuits, and lastly, flexible chips in which all components are inherently flexible. This perspective article analyzes technical challenges that arise concerning the development of sustainable materials and processing technologies, complex heterogeneous integration, as well as advanced packaging architectures, standardization, and reliability testing. The economic implications for the semiconductor technology transition to hybrid chips is presented in terms of manufacturing costs, economic feasibility, and market readiness. Key insights and future application opportunities are provided, while recent advancements in the field are summarized. This perspective article suggests that by addressing these challenges, hybrid chips have the potential to transform electronic components and systems across a wide range of industries and use case scenario. The advancement of hybrid chip technologies by enhancing the collaboration between industry and academia as well as policymakers will be a crucial part in the realization of required sustainability goals within the worldwide Chips Act initiative, while ensuring the technological progress has the right balance between improved performance and sustainability.

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Determining Mechanical Stress Testing Parameters for FHE Designs with Low Computational Overhead

et al. 2020

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Optimized Stress Testing for Flexible Hybrid Electronics Designs

Cited by 3 publications

References 22 publications

Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics

Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics

Hybrid chips to enable a sustainable internet of things technology: opportunities and challenges

Determining Mechanical Stress Testing Parameters for FHE Designs with Low Computational Overhead

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