Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics

Palavesam, Nagarajan; Hell, Waltraud; Drost, A.; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz

doi:10.3390/electronics9020238

Cited by 10 publications

(4 citation statements)

References 50 publications

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“…Vanfleteren et al reported an ultra-thin microcontroller (thickness: 20 µm) that performed on a flexible substrate at a curvature radius of 3.3 mm [12,13]. Also, K. Bock group reported roll-to-roll process and chip-foil packaging using ultra-thin silicon chips [14,15].…”

Section: Introductionmentioning

confidence: 99%

Flexible substrate with floating island structure for mounting ultra-thin silicon chips

Takeshita

Takei

Yamashita

et al. 2020

Flex. Print. Electron.

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A flexible substrate with a novel floating island structure design was developed for mounting ultra-thin silicon chips. The structure reduced the strain propagated from the stretching base to the ultra-thin silicon chips. While conventional structures reduce strain by 64.2%, the floating island structure reduced strain by 90.2%. Furthermore, tests for operational stability and durability were conducted using an ultra-thin operational amplifier (OPAMP) mounted on the flexible substrate with a floating island structure, where the OPAMP was thinned to 30 µm by chemical mechanical polishing. The ultra-thin OPAMP operated with no strain effects even when repeatedly stretched to 30% elongation. Also, the ultra-thin silicon chip mounted on the floating island structure demonstrated durability against >25 000 stretching cycles. This research is applicable for functional wearable devices using ultra-thin silicon chips and featuring high flexibility and stretchability.

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Section: Introductionmentioning

confidence: 99%

Flexible substrate with floating island structure for mounting ultra-thin silicon chips

Takeshita

Takei

Yamashita

et al. 2020

Flex. Print. Electron.

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“…The dynamic bending reliability (fatigue) of such ICs is quite important. Palavesam et al found that gold has better fatigue performance compared to copper and aluminum [ 73 ].…”

Section: Flexible Interconnectsmentioning

confidence: 99%

Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications

2023

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Flexible electronic devices require metal interconnects to facilitate the flow of electrical signals among the device components, ensuring its proper functionality. There are multiple factors to consider when designing metal interconnects for flexible electronics, including their conductivity, flexibility, reliability, and cost. This article provides an overview of recent endeavors to create flexible electronic devices through different metal interconnect approaches, with a focus on materials and structural aspects. Additionally, the article discusses emerging flexible applications, such as e-textiles and flexible batteries, as essential considerations.

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“…The authors also produced contact pads compatible with 6-pin zero insertion force (ZIF) connectors commonly used in printed circuit boards for portable and wearable electronics. [40,41] The PET test pattern configuration is depicted in Figure 1. Additional details can be found in the Supporting Information.…”

Section: Fabrication Of Plastic Rgo Lgtsmentioning

confidence: 99%

Selective Ion Sensing in Artificial Sweat Using Low‐Cost Reduced Graphene Oxide Liquid‐Gated Plastic Transistors

Oliveira

Livio

González‐García

et al. 2022

Small

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Health monitoring is experiencing a radical shift from clinic‐based to point‐of‐care and wearable technologies, and a variety of nanomaterials and transducers have been employed for this purpose. 2D materials (2DMs) hold enormous potential for novel electronics, yet they struggle to meet the requirements of wearable technologies. Here, aiming to foster the development of 2DM‐based wearable technologies, reduced graphene oxide (rGO)‐based liquid‐gated transistors (LGTs) for cation sensing in artificial sweat endowed with distinguished performance and great potential for scalable manufacturing is reported. Laser micromachining is employed to produce flexible transistor test patterns employing rGO as the electronic transducer. Analyte selectivity is achieved by functionalizing the transistor channel with ion‐selective membranes (ISMs) via a simple casting method. Real‐time monitoring of K+ and Na+ in artificial sweat is carried out employing a gate voltage pulsed stimulus to take advantage of the fast responsivity of rGO. The sensors show excellent selectivity toward the target analyte, low working voltages (<0.5 V), fast (5–15 s), linear response at a wide range of concentrations (10 µm to 100 mm), and sensitivities of 1 µA/decade. The reported strategy is an important step forward toward the development of wearable sensors based on 2DMs for future health monitoring technologies.

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Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics

Cited by 10 publications

References 50 publications

Flexible substrate with floating island structure for mounting ultra-thin silicon chips

Flexible substrate with floating island structure for mounting ultra-thin silicon chips

Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applications

Selective Ion Sensing in Artificial Sweat Using Low‐Cost Reduced Graphene Oxide Liquid‐Gated Plastic Transistors

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