Reported for the first time is a full GaAs-based room-temperature nearinfrared (NIR) up-conversion device fabricated by wafer-fusing a GaNAsSb/GaAs pin photodetector (PD) with a GaAs/AlGaAs lightemitting diode (LED). NIR photons with wavelengths in the range 1.3 -1.6 mm were up-converted to 0.87 mm.Introduction: Infrared up-conversion devices have attracted much interest owing to various applications such as lasing [1], three-dimensional displays [2], laser cooling [3], and infrared imaging [4]. Compared with other up-conversion techniques, photodetector (PD) light-emitting-diode (LED) up-conversion has the advantages of compactness, simplicity, low excitation power and high operation temperature. A PD-LED up-conversion device is typically composed of two major parts, a PD and an LED. Incident infrared photons are absorbed by the PD, resulting in a photocurrent that drives the LED to emit photons with higher energy. The most investigated NIR PD is the InGaAs photodiode based on an InP substrate, which can routinely reach a responsivity higher than 1 A/W. Since 2000, NIR up-conversion devices with InGaAs/InP PDs have been fabricated [5,6]. In addition to InP-based PDs, GaAs-based NIR PDs lattice matched to GaAs substrate are now able to cover the important 1.3-1.55 mm wavelength region, with responsivities comparable to InGaAs/InP photodiodes [7,8]. On the light emitting side, high efficiency is desired. InP-based LEDs have very low internal quantum efficiencies of less than 1%. However, GaAs/AlGaAs LEDs are capable of high internal efficiencies of near 100% [6]. Therefore, NIR up-conversion devices with both PD and LED based on GaAs substrates are advantageous.In an earlier study, we demonstrated GaAs-based NIR up-converters with the potential of reaching high up-conversion efficiencies [9]. However, the sample was composed of two discrete parts, a GaAsbased PD and a commercial LED, while in the present work we have successfully fabricated an integrated full GaAs-based NIR up-conversion device for the first time.