Optimization of Wire Loop Height for a Cavity Down Plastic Pin Grid Array Package

Abstract

A study has been conducted to resolve wire neck break problem in a cavity-down plastic pin grid array (PPGA) packages with a specific range of parameters when subjected to temperature cycle (−55°C/+125°C). In most cases, a weak or broken neck of the wire was observed after 300 cycles of temperature cycling. The objective of this study is to determine an optimum wire loop height so that the package can pass a 1000 temperature cycles. Results of a simulation study, performed by other researchers, using a finite element model (FEM) were utilized. Their work considered the effect of temperature cycling on PPGA packages identical to those in this report. Several possible factors that can contribute to this failure mechanism were analyzed, and stresses in the wires were evaluated. The simulation results were verified by running an experiment on actual parts. The parts were subjected to temperature cycling, and data was gathered at different test points. The experimental results obtained did concur with simulation results which suggested that the area just above the ball experienced a significant level of thermal stresses, and such stresses could be reduced by determining an optimum loop height.

Optimal process parameters design for a wire bonding of ultra‐thin CSP package based on hybrid methods of artificial intelligence

“…(Chen and Lin, 2000; Tsao, 2000; Su and Chiang, 2003). The widely‐used statistical research methods are: design of experiment (DOE) (Groover et al , 1994), response surface methodology (RSM) (Shu, 1992), finite element method (Liu et al , 2004; Chaudhry and Barez, 1998) and Taguchi method (Chen, 2000). The advantage of using the Taguchi method is in the reduction of both production cost and time.…”