Optimal process parameters design for a wire bonding of ultra‐thin CSP package based on hybrid methods of artificial intelligence

Hung, Yung‐Hsiang

doi:10.1108/13565360710779136

Cited by 10 publications

(4 citation statements)

References 20 publications

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“…Their approach successfully reduced the cost of experimentation and, consequently, can be recommended for full-scale production plants. Hung (2007) applied Taguchi methods with hybrid artificial intelligence methods to solve optimum parameters in wire bonds design for an ultra-thin scale CSP package. This improved the robustness design yield.…”

Section: Hybrid Optimization Methodsmentioning

confidence: 99%

“…While single models have considered the Taguchi method alone, combination models have amalgamated. Taguchi with fuzzy (Chen and Hung, 2006), fuzzy goal programming (Al-Refaie, 2015), grey relational analysis (Kumar and Pandey, 2015), hybrid artificial intelligence (Hung, 2007), neural network (Zagloel and Al-Aina, 2009), principal component analysis (Chen et al, 2009). Among the various optimization techniques such as linear programming, dynamic programming, goal programming, and Taguchi technique, the Taguchi methodical (TM) framework provides extra desirable attributes.…”

Section: Observations and Limitations Of Related Literaturementioning

confidence: 99%

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The Optimization of Packaging System Process Parameters Using Taguchi Method

Fagbolagun

Oke

2020

IJIEEM

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Packaging systems constitute substantially to product cost, its safety, and optimization. Unfortunately, no previous optimization studies have examined the packaging system in a bottling process plant for the unique, developing country environment. Consequently, the Taguchi method is applied to optimize a process plant's packaging system in a Nigerian plant's real-life situation. Optimal combinations of packaging system parameters that minimize product waste are created. An L4 (23) Taguchi orthogonal array was selected to analyze the data, and signal-to-noise ratios were computed for each experiment's run. Since the aim was to minimize beer waste, the ‘the-smaller-the-better’ signal-to-noise ratio was chosen in the analysis. S/N ratio plots revealed the optimum settings to obtain minimal product waste, namely, A2, B1, and C2 from the main effects plot for signal-to-noise ratios. A two-way ANOVA was performed on the significant factors to determine their percentage contributions to the response (product waste). Through Taguchi's innovative approach, the feasibility of optimizing the packaging process parameters was demonstrated and validated.

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Section: Hybrid Optimization Methodsmentioning

confidence: 99%

Section: Observations and Limitations Of Related Literaturementioning

confidence: 99%

The Optimization of Packaging System Process Parameters Using Taguchi Method

Fagbolagun

Oke

2020

IJIEEM

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“…In computer and electronic product manufacturing industry, Hung [45] combined the Taguchi method with GA and ANN to use them as the optimal tool in wire bond designing parameters for an ultra-thin chip scale package (CSP), and then construct a set of the optimal parameter analysis flow and steps.…”

Section: Parameter Optimizationmentioning

confidence: 99%

Review of data mining applications for quality assessment in manufacturing industry: support vector machines

Rostami

Dantan

Homri

2015

Int. J. Metrol. Qual. Eng.

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is an open access repository that collects the work of Arts et Métiers ParisTech researchers and makes it freely available over the web where possible. AbstractIn many modern manufacturing industries, data that characterize the manufacturing process are electronically collected and stored in the databases.Due to advances in data collection systems and analysis tools, data mining (DM)has widely been applied for quality assessment (QA) in manufacturing industries.In DM, the choice of technique to use in analyzing a dataset and assessing the quality depend on the understanding of the analyst. On the other hand, with the advent of improved and efficient prediction techniques, there is a need for an analyst to know which tool performs best for a particular type of data set.Although a few review papers have recently been published to discuss DM applications in manufacturing for QA, this paper provides an extensive review to investigate the application of a special DM technique, namely support vector machine (SVM) to solve QA problems. The review provides a comprehensive analysis of the literature from various points of view as DM preliminaries, data preprocessing, DM applications for each quality task, SVM preliminaries, and application results. Summary tables and figures are also provided besides to the analyses. Finally, conclusions and future research directions are provided.

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“…The gold wire bonding process is a process of integrated circuit (IC) products, which are the main parts in electronic devices such as mobile phones, televisions, etc., The IC packaging product consists of two main processes, namely, Front of Line (FOL) production, which consists of five sub processes, and End of Line (EOL) [4], which consists of four sub processes. The most important process of IC Packaging production is the gold wire bonding process in the FOL because it connects the main circuit of IC packaging using small gold wire [5,6].…”

Section: Introductionmentioning

confidence: 99%

Model Analyzing for Reusing Gold Wire Capillary in the Gold Wire Bonding Process

Phimpha¹,

Sindhuchao²

2021

IIUMEJ

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Manufacturing process improvement is necessary for manufacturers to gain business advantages. Re-using or increasing the useful lives of machine parts is considered to be a process of performance improvement. To re-use parts, the manufacturers must know the effects of the factors related to workpieces' qualities to prevent defects. This research study aims at presenting the results of analysing the effects of the factors and mathematical models for bond shear strength when reusing gold wire bonding capillary in the gold wire bonding process of integrated circuit (IC) products using design experiment. The operation factors in the reference experiment, including bond force, bond time, USG current, EFO current and EFO gap, are investigated. The Fractional Factorial Design was used to determine five factors that affect the bond shear strength. The analysis of the results show that the bond force is a significant factor where increasing bond force factors leads to increasing bond shear strength. In the end, a Regression model of bond shear strength is obtained to show the result between the bond shear strength and effect of factors. ABSTRAK: Proses pembaharuan pengilangan adalah penting untuk para pengilang bagi memperoleh keuntungan bisnes. Guna-semula atau menambah jangka hayat pada bahagian-bahagian tertentu pada mesin adalah dianggar sebahagian proses penambahbaikan prestasi mesin. Bagi mengguna semula bahagian-bahagian ini, pengilang mesti mengetahui akibat sesuatu faktor berkaitan kualiti bahan bagi mengelak kecacatan. Kajian ini bertujuan menyampaikan dapatan kajian melalui kesan faktor dan model matematik pada kekuatan ricihan ikatan apabila mengguna semula wayar emas melalui proses kapilari ikatan wayar emas pada produk litar bersepadu melalui rekaan eksperimen. Faktor operasi melalui rujukan eksperimen dari daya ikatan, masa ikatan, arus USG, arus EFO dan jarak EFO dikaji. Rekaan Faktorial Pecahan digunakan bagi mendapatkan lima faktor yang mempengaruhi kekuatan ricihan ikatan. Dapatan kajian menunjukkan daya ikatan merupakan faktor penting di mana, pertambahan faktor daya ikatan menguatkan ricihan ikatan. Akhirnya, model Regression kekuatan ricihan ikatan diperoleh bagi menjelaskan dapatan kajian antara kekuatan ricihan ikatan dan kesan faktor.

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Optimal process parameters design for a wire bonding of ultra‐thin CSP package based on hybrid methods of artificial intelligence

Cited by 10 publications

References 20 publications

The Optimization of Packaging System Process Parameters Using Taguchi Method

The Optimization of Packaging System Process Parameters Using Taguchi Method

Review of data mining applications for quality assessment in manufacturing industry: support vector machines

Model Analyzing for Reusing Gold Wire Capillary in the Gold Wire Bonding Process

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