2017
DOI: 10.1016/j.applthermaleng.2017.07.136
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Optimization of the thermal distribution of multi-chip LED package

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Cited by 53 publications
(14 citation statements)
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“…From Ben Abdelmlek et al (2017), the optimal pitch of 3 × 3 LED array and 2.82 mm length, the translation from square to circular geometry permits us to put ten chips instead of nine with respect of the same pitch (distance between two chips), as it is shown in Figure 18.…”
Section: Resultsmentioning
confidence: 99%
“…From Ben Abdelmlek et al (2017), the optimal pitch of 3 × 3 LED array and 2.82 mm length, the translation from square to circular geometry permits us to put ten chips instead of nine with respect of the same pitch (distance between two chips), as it is shown in Figure 18.…”
Section: Resultsmentioning
confidence: 99%
“…Abdelmlek [16] studied the number and arrangement of LED-chips on the heat-sink owing to the different effect of junction temperature. Later, the same group also investigated the optimization of different chip size, disposition on different substrate [17]. These authors also proposed a new thermal resistance model to precise estimate the junction and phosphor temperature, which proves the feasibility of the estimated model [18].…”
Section: Introductionmentioning
confidence: 90%
“…In the latest decade, the electro-optic conversion efficiency of the light emitting diode (LED) was about 10%-15%. The temperature distribution of high-power LED lamps has greater negative influence on the efficiency [1][2][3]. Much literature focused on experimental method to reduce the maximum temperature of radiator of high-power LED lamps [4][5][6][7], additionally a 3-D numerical model was used in open literature to study the steady-state temperature distribution [8].…”
Section: Introductionmentioning
confidence: 99%