“…For smaller transistors, densely crowded in integrated circuits, thermal management becomes critical to avoid thermal failure due to differential thermal expansion of components and extend their operational lifetime [1,2]. Several approaches to cooling microelectronics were explored in the past, such as single-phase liquid cooling [3][4][5], flow boiling [6,7], jet impingement cooling [8][9][10], spray cooling [11], heat pipes [12], liquid metal cooling [13,14], indirect cooling with phase change materials [15], and pool boiling [16,17]. Pool boiling is one of the most promising methods of thermal management problem, which stems from high latent heat of evaporation of liquids.…”