Optimization of lead-free wave soldering process using taguchi orthogonal arrays

Abstract

Process of lead-free soldering is deeply monitored starting from July 2006, when RoHS directive was activated. The goal of the work was to analyze influence of 4 control parameters of a process of lead-free soldering on bridging and filling of through holes on a test board.Following control parameters (factors) were taken into account: the solder temperature, the time of a contact between the soldered area and solder, the preheating temperature and flux wettability. Every factor was used in 3 levels. Taguchi orthogonal array of the type L9 was used for process analysis. The analysis showed that bridging is influenced with the preheating temperature and with the time of a contact between solder and a pad dominantly, influence of the solder temperature is minimal. The filling of the through hole depends above all on the preheating temperature; influence of other control parameters is low. It has been also confirmed effectiveness of the use of Taguchi orthogonal array in comparison with full factorial experiments.

Optimization of pin through hole connector in thermal fluid–structure interaction analysis of wave soldering process using response surface methodology

“…An optimization is a fundamental process that is systematically applied in most engineering applications by using various optimization techniques such as Taguchi method [1,2], response surface methodology (RSM) [3], artificial neural networks [4], genetic algorithm [5] and neuro-fuzzy genetic algorithm [6]. Optimization often produces solutions that are better than the conventional solution.…”

“…Therefore, a systematic technical approach has been introduced to provide a more reliable solution than the conventional solution. Optimization of wave soldering had been experimentally investigated by using Taguchi method [1,2], the neural network approach [4,7], and mixed-level fractional factorial design [8]. In addition, an expert system that uses a self-organizing map [9][10][11] had been used to diagnose and optimize the process condition in wave soldering.…”

Optimising pin-in-paste technology using gradient boosted decision trees

“…Early-stage optimisations can be realised for example by statistical methods (Lee et al, 2008), by genetic algorithms (Zhang et al, 2008;Tsai, 2012) or by decision trees (Teixidor et al, 2015). For the soldering of through-hole components, Mach et al (2010) performed the optimisation of the wave soldering process using Taguchi orthogonal arrays; however, traditional wave soldering technology is mostly excluded from the soldering methods of through-hole components today. Reduced order modelling was used for miniaturised components by Stoyanov et al (2010), and similarity approach was used by the same author for qualifying a specific process without subjecting components to the respective qualification experimental (Stoyanov et al, 2016).…”

Propostas de design de layout da PCI para redução de curto circuito de solda a onda, para processo de montagem de placa eletrônica

“…O curto circuito de solda, que ocorre durante o processo de solda por onda, normalmente é combatido através de alterações de parâmetros relacionados ao processo que a indústria se utiliza, como conclui o trabalho de P.Mach, P.Zeman, E.Ktrcova [10], [11]. O engenheiro de processo foca em ajustes dos parâmetros como:…”