Electroless copper deposition was investigated on epoxy laminate substrates (Isola 185HR) using a silver-based catalyst, and a nonroughening surface treatment method based on sulfuric acid. The current challenges in electroless copper deposition include (i) high cost of Pd-based catalysts, (ii) deterioration of electrical performance of deposited metal at high frequency due to electron scattering at the roughened surface, and (iii) limited adhesion strength of electroless layers to substrates. We investigated an electroless copper deposition procedure composed of a H 2 SO 4 surface pretreatment, two-step Sn/Ag nano-colloidal catalyst seeding, and immersion in a traditional formaldehyde-containing electroless copper bath. The H 2 SO 4 pretreatment activated the epoxy surface for electroless deposition. Other strong acids did not lead to deposition. The H 2 SO 4 treatment cleaned the substrate and provided the adhesion of the catalyst and electroless copper without increasing the surface roughness. XPS results showed a decrease in the carbonyl groups (C=O), and acid/ester functionalities (O-C=O) at the surface. Adsorbed sulfate on the substrate from the H 2 SO 4 treatment led to Sn(II) sensitization. The tin-silver activation step resulted in Sn(IV) and Ag(0) products in the form of a Sn/Ag nano-colloidal catalyst. The Sn/Ag colloid acted as a catalyst for electroless copper deposition on the epoxy laminate substrates.