Optimization of interconnections between packaging levels

Kelly, John; Lim, C. K.; Chen, W. T.

doi:10.1147/rd.286.0719

Cited by 12 publications

(2 citation statements)

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“…While optimization of the geometry of the pinattachment regions of the alumina/molybdenum substrate focused on reducing stress in the solder to limit solder fracture [9,10], optimization for the glass-ceramic/copper substrate was focused on reducing process stress in the substrate itself.…”

Section: I/o Pin Attachmentmentioning

confidence: 99%

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Electrical connections to the thermal conduction modules of the IBM Enterprise System/9000 water-cooled processors

1992

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In a complex multichip carrier such as the thermal conduction module (TCM) of IBM high-performance mainframe processors, the interfaces between chips and their substrate as well as between the substrate and its printed circuit board must support a large number of electrical connections. Since chip, substrate, and board typically comprise very different materials, the electrical connections between them must be able to accommodate considerable thermally induced mechanical stress during assembly and use. This paper describes the pin attachment, chip attachment. wire bonding, and laser deletion processes used for forming the electrical connections to theglass-ceramic/copper/polyimide/copper substrate of the thermal conduction modules of the IBM Enterprise System/9000™ watercooled processors.

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Section: I/o Pin Attachmentmentioning

confidence: 99%

“…Use is made of the hard solder Au-20 wt% Sn eutectic (melting point: 281°C) for the alumina/molybdenum substrates because of the high room-temperature strength and modulus of this material {E = 75 GPa, a^ = 13 MPa)* [10,11]. Because of present mechanical requirements, use of the Au-20 wt% Sn eutectic was continued.…”

Section: I/o Pin Attachmentmentioning

confidence: 99%