2014
DOI: 10.1108/ilt-07-2012-0063
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Optimization of chemical mechanical polishing parameters on surface roughness of steel substrate with aluminum nanoparticles via Taguchi approach

Abstract: Purpose – The purpose of this paper is to investigate the effects of abrasive contents, oxidizer contents, slurry flow rate and polishing time in achieving a mirror-like finish on polished surfaces. Chemical mechanical polishing (CMP) is now widely used in the aerospace industry for global planarization of large, high value-added components. Design/methodology/approach – Optimal parameters are applied in experimental trials performed to … Show more

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Cited by 11 publications
(4 citation statements)
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“…After selecting the optimum level of design parameters, it is a mandatory step to identify and verify the improvement in quality performance using the optimal level of design parameters. According to references [23,25,26], the predicted signal-tonoise ratio for the optimal level of the design process parameters can be calculated as:…”
Section: Pulse Arc Welding Taguchi Optimizationmentioning
confidence: 99%
“…After selecting the optimum level of design parameters, it is a mandatory step to identify and verify the improvement in quality performance using the optimal level of design parameters. According to references [23,25,26], the predicted signal-tonoise ratio for the optimal level of the design process parameters can be calculated as:…”
Section: Pulse Arc Welding Taguchi Optimizationmentioning
confidence: 99%
“…CMP can achieve an ultra-smooth and damage-free surface by the synergistic effect of chemical and mechanical interactions [7,8]. For this reason, CMP has been gradually applied in processing key basic parts with bearing steels as the main material, such as GCr15 steel [10][11][12][13][14]. The complexing agent is one of the most critical additives for metals CMP, and it is used to enhance the material removal rate (MRR) as well as to reduce defects by chelating metal ions to form soluble complexes.…”
Section: Introductionmentioning
confidence: 99%
“…Kao et al 19 obtained surface roughness of 8.4 nm in the CMP of steel substrates using SiO 2 prepared by sol-gel method. Peng et al 20,21 optimized polishing parameters in the CMP of AISI 52100 steel using Taguchi design and achieved surface roughness ∼6.7 nm. Cui et al 22 introduced the composition and action mechanism of polishing slurry through theoretical analysis and comparative experiments in the CMP of stainless steel.…”
mentioning
confidence: 99%