Optimization and Characterization of Flexible Polymeric Optical Waveguide Fabrication Process for Fully Embedded Board-level Optical Interconnects

Shiah, Lim Li; Teo, Chek Sing; Yee, Hong Lor; Wei, Tan; Chai, J.; Jie, Yap Guan; Guan, Lim Teck; Ramana, P.V.; Lau, John H.; Chang, Richard; Chang, Hwan‐You; Tang, Tom; Chiang, S.C.L.; Cheng, David; Tseng, T.J.

doi:10.1109/eptc.2008.4763578

2008 10th Electronics Packaging Technology Conference 2008

DOI: 10.1109/eptc.2008.4763578

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Optimization and Characterization of Flexible Polymeric Optical Waveguide Fabrication Process for Fully Embedded Board-level Optical Interconnects

Lim Li Shiah

Chek Sing Teo

Hong Lor Yee

et al.

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Fabrication of fully embedded board-level optical interconnects and optoelectronic printed circuit boards

Chang¹,

Chang²,

Lau

et al. 2009

2009 11th Electronics Packaging Technology Conference

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The manufacturing processes of an optoelectronic printed circuit board (OEPCB) with an embedded board-level polymeric waveguide and vertical-optical channel interconnection are presented in this paper. The optoelectronic packages contain one vertical cavity surface emitting laser (VCSEL), one photo detector (PD), surface mount technology (SMT) components and one fully embedded board-level optical interconnects. The first step is to fabricate a polymeric waveguide structure with two 45-degree mirrors, and then embedded the waveguide in the center with two prepreg to form a horizontal optical channel inside a printing circuit board by a two-step laminating process. The vertical-optical channel is made by a three-step process, conformal mask forming, laser ablating and copper etching. This vertical channel is connected to the mirror of the horizontal waveguide. A wide, collimated optical beam couples a package board across a narrow, long air gap and provides a large tolerance to misalignment during the SMT process.

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Fabrication of fully embedded board-level optical interconnects and optoelectronic printed circuit boards

Chang¹,

Chang²,

Lau

et al. 2009

2009 11th Electronics Packaging Technology Conference

Self Cite

View full text Add to dashboard Cite

show abstract

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Optimization and Characterization of Flexible Polymeric Optical Waveguide Fabrication Process for Fully Embedded Board-level Optical Interconnects

Cited by 1 publication

References 13 publications

Fabrication of fully embedded board-level optical interconnects and optoelectronic printed circuit boards

Fabrication of fully embedded board-level optical interconnects and optoelectronic printed circuit boards

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