Optimal thermal design of a high power package using the design of experiment (DOE)

Gao, Cha; Qin, Fei; Zhu, Wenhui; Xia, Guofeng; Ma, Xiaobo

doi:10.1109/icept-hdp.2012.6474692

Cited by 4 publications

(2 citation statements)

References 10 publications

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“…The legitimate question is: which combination is the best? Design of experiment (DOE) has been widely used in various aspects in IC manufacturing [4][5][6][7][8][9][10], from process tuning to designs. For example, Gao et al [6] employed DOE to optimize Through Silicon Via (TSV) dimension.…”

Section: Troductiomentioning

confidence: 99%

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Employing optimal experimental design to optimize the accelerated life test plan for TDDB

Cheng

Yang

et al. 2015

2015 Annual Reliability and Maintainability Symposium (RAMS)

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Time Dependent Dielectric Breakdown (TDDB) is one of the major indices to evaluate the Gate Oxide Integrity (GOI) reliability of Integrated Circuit (IC) devices. Permutation and combination theory helps to derive the many combinations of temperature and voltage stress levels to determine TDDB parameters (i.e., and Ea) with a pre-specified sample size. In this work, a statistical tool (JMP10) with optimal experimental design platform for accelerated life test (ALT) is employed to select stressing conditions, to optimize the ALT test plan with a special distribution of sample size for each stressing condition, to model parameter estimation, and to predict lifetimes. Comparing our proposed DOE method to the most popular conventional method, we find our DOE method is better from both theoretical and experimental standpoints. Based on this study, we propose an optimized combination of stressing conditions and sample size allocation for each stress condition. Our proposed method saves capacity, shortens half of the test time, and obtains a narrower confidence interval (CI) of the estimated TDDB lifetime.

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Section: Troductiomentioning

confidence: 99%

“…For example, Gao et al [6] employed DOE to optimize Through Silicon Via (TSV) dimension. DOE approach was also used to find the main factors and the optimal combination of control factors to minimize the thermal resistance of high power packages [7]. DOE was also applied to design reliability test plans.…”

Section: Troductiomentioning

confidence: 99%