Optimal Sensor Placement Methods for Active Power Electronic Systems

Peddada, Satya R. T.; Tannous, Pamela J.; Alleyne, Andrew G.; Allison, James T.

doi:10.1115/detc2017-68253

Cited by 2 publications

(2 citation statements)

References 50 publications

(51 reference statements)

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“…These strategies include integer programming methods, continuous relaxation methods, or even intuition-based methods [64]. The strategy adapted to solve the optimal sensor placement problem in this work is related to information-based performance metrics.…”

Section: Optimal Sensor Placementmentioning

confidence: 99%

“…Table 5.6 shows the optimal sensor placement for the full order RC thermal model using the trace of the observability Gramian as a trade-off. Using that table, the optimal locations of the 5 sensors in the full order thermal model can be found by checking the redundancy of the states of the full order RC thermal model that correspond to the optimal locations in the reduced order RC thermal model in that table [64].…”

Section: Continuous-discrete Kalman Filtermentioning

confidence: 99%

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Dynamic temperature estimation of power electronics systems

Tannous

Peddada

Allison

et al. 2017

2017 American Control Conference (ACC)

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This thesis proposes a method for accurate temperature estimation of thermally-aware power electronics systems. The duality between electrical systems and thermal systems was considered for thermal modeling. High dimensional thermal models present a challenge for online estimation. RC (resistor-capacitor) circuits that create a tradeoff between accuracy and complexity were used to simulate the dynamic thermal behavior of power electronics. The complexity of the thermal network was further reduced by applying a structure-preserving model order reduction technique. The reduced order thermal model was an RC circuit with fewer capacitors. Preserving the physical correspondence between the reduced order model and the physical system allows the user to use the reduced order thermal model in the sensor placement optimization process. The accuracy of the thermal estimates can be easily increased by increasing the number of sensors in the system. However, a large number of sensors increases the cost and complexity of the system. It might also interfere with the circuit design and create packaging problems. An optimal number and optimal placement of temperature sensors was found. The optimal sensor placement problem was solved by maximizing the trace of observability Gramian. The optimal number of temperature sensors was based on the state estimation error obtained from a Kalman filter. The dynamic thermal behavior of the power electronics systems was represented by a linear state space model by applying the conservation of energy principle. Therefore, assuming Gaussian noise, it is well-known that a Kalman filter is an optimal estimator for such systems. A continuous-discrete Kalman filter was used to estimate the dynamic thermal behavior of power electronics systems using an optimal number of temperature sensors placed at optimal locations. The proposed method was applied on 2-D and 3-D power electronics systems. Theoretical results were validated experimentally using IR thermal imaging and thermocouples. It was shown that the proposed method can accurately iii reconstruct the dynamic temperature profile of power electronics systems using a small number of temperature sensors. for Power Optimization of Electro-Thermal Systems (POETS). I feel so lucky to be part of this multidisciplinary research center that gave me the opportunity to work with extraordinary people from different disciplines and different institutions. Tables Table 2.1 Thermal-electric analogy used to model resistor-capacitor thermal models. ........... 6 Table 5.1 Dimesions for the inverter regions defined in Figure 5

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Section: Optimal Sensor Placementmentioning

confidence: 99%

Section: Continuous-discrete Kalman Filtermentioning

confidence: 99%

Dynamic temperature estimation of power electronics systems

Tannous

Peddada

Allison

et al. 2017

2017 American Control Conference (ACC)

Self Cite

View full text Add to dashboard Cite

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Toward Holistic Design of Spatial Packaging of Interconnected Systems With Physical Interactions (SPI2)

Peddada

Zeidner

Ilieş

et al. 2022

Journal of Mechanical Design

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Three-dimensional spatial packaging of interconnected systems with physical interactions (SPI2) design plays a vital role in the functionality, operation, energy usage, and lifecycle of practically all engineered systems, from chips to ships. SPI2 design problems are highly-nonlinear, involving tightly constrained component placement, governed by coupled physical phenomena (thermal, hydraulic, electromagnetic, etc.), and involve energy and material transfer through intricate geometric interconnects. While many aspects of engineering system design have advanced rapidly in the last few decades through breakthroughs in computational support, SPI2 design has largely resisted automation, and in practice requires at least some human-executed design steps. SPI2 system reasoning and design decisions can quickly exceed human cognitive abilities at even moderate complexity levels, thwarting efforts to accelerate design cycles and tackle increasingly complex systems. Existing design methods treat pieces of the SPI2 problem separately without a fundamental systems approach, are sometimes inefficient to evaluate various possible designs and present barriers to effective adoption in practice. This article explores a vision of a holistic SPI2 design approach needed to develop next generation automated design methods capable of rapidly producing viable SPI2 design candidates. We review several technical domains related to holistic SPI2 design, discuss existing knowledge gaps and practical challenges, examine exciting opportunities at the intersection of multiple domains that can enable comprehensive exploration of SPI2 design spaces, and present one viable two-stage SPI2 design automation framework. Holistic SPI2 design opens up a new direction of high industrial and societal relevance for the design research community.

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Optimal Sensor Placement Methods for Active Power Electronic Systems

Cited by 2 publications

References 50 publications

Dynamic temperature estimation of power electronics systems

Dynamic temperature estimation of power electronics systems

Toward Holistic Design of Spatial Packaging of Interconnected Systems With Physical Interactions (SPI2)

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