We demonstrate well-controlled crystallographic etching of wurtzite GaN grown on c-plane sapphire using H 3 PO 4 , molten KOH, KOH dissolved in ethylene glycol, and NaOH dissolved in ethylene glycol between 90 and 180°C, with etch rates as high as 3.2 m/min. The crystallographic GaN etch planes are ͕0001͖, ͕1010͖, ͕101 1͖, ͕101 2͖, and ͕1013͖. The vertical ͕1010͖ planes appear perfectly smooth when viewed with a field-effect scanning electron microscope. The activation energy is 21 kcal/mol, indicative of reaction-rate limited etching.