1995
DOI: 10.1116/1.588296
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Optically matched trilevel resist process for nanostructure fabrication

Abstract: A novel trilevel resist process has been developed which enables high-contrast imaging of periodic structures with spatial periods down to 200 nm in thick resist on highly reflective substrates, using ϭ351.1 nm argon-ion laser exposure. The process utilizes a 200-nm-thick, high-contrast, imaging resist layer, a thin ͑ϳ15-nm͒ evaporated dielectric interlayer, and a 300-600-nm-thick bottom antireflection coating ͑ARC͒ which suppresses reflections from the substrate. Our trilevel resist scheme has been implemente… Show more

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Cited by 82 publications
(44 citation statements)
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“…In the work reported here, XHRi-16 (produced by Brewer Science, Inc.) was used as an ARC. In order to be able to transfer the PR pattern through the ARC layer, a Trilevel Resist Process can be applied [8]. In this process a hard etch mask is deposited between the ARC and the PR.…”
Section: Trilevel Resist Processmentioning
confidence: 99%
“…In the work reported here, XHRi-16 (produced by Brewer Science, Inc.) was used as an ARC. In order to be able to transfer the PR pattern through the ARC layer, a Trilevel Resist Process can be applied [8]. In this process a hard etch mask is deposited between the ARC and the PR.…”
Section: Trilevel Resist Processmentioning
confidence: 99%
“…Furthermore, it allows mass production of particle arrays in large and uniform areas at a much lower cost compared to the EBL method [38,39]. LIL can be simply performed using Lloyd's configuration [40]. The Lloyd holder is attached on a rotating stage with a high angle precision to have a fine control of the periodicity.…”
Section: Laser Interference Lithographymentioning
confidence: 99%
“…The plasmon resonance properties of the metallic structures fabricated can be modified by this simple sample-rotation approach [91]. After the transfer of the nanopatterns by chemical etching or lift-off, this nanostructure can be used for the patterned media in high-density data storage, microsieves for microfiltration and submicrometer perforated membranes, nanotemplate for self-assembly and field emission flat-panel displays [92][93][94].…”
Section: Laser Interference Lithographymentioning
confidence: 99%