of scalability. Second, optically active defects in the material are known in the visible and the infrared range, thus overcoming stringent criteria for long distance quantum protocols that require low transmission losses through optical fibers. [5] Third, a range of defects in this material is known to possess manipulatable spin properties, which is crucial towards the realization of optically addressable qubits. [6][7][8][9][10][11][12][13][14][15][16][17] Recent progress regarding the characterization of these defects has also shown exceptionally long coherence times, boosting their attractiveness and applicability as quantum memory. [18][19][20][21] Exceeding these major advantages, the material also has an exceptionally high refractive index of ≈2.6 in the visible and infrared (IR), a piezoelectric response, strong higher-order non-linearities, [22,23] and can be reliably doped into p and n-type forms. This expansive list of material properties gives SiC an almost unrivaled status as a material platform to realize nanophotonic integrated circuits with potential applications in quantum technologies.Yet, to fully leverage the potential of SiC quantum emitters, reliable fabrication approaches are essential for the engineering of photonic architectures and to augment their qubit properties. [1,[24][25][26][27] Accordingly, various fabrication methods and protocols have emerged over the recent years. Initially, such schemes included the fabrication of devices from epitaxial SiC thin films grown on Si, which could be released by a standard wet chemical etch. [28][29][30][31][32] However, this is only applicable to the 3C polytype and moreover suffers from growth defects at the Si-SiC interface. As an alternative differently doped epitaxial layers of 4H-SiC were utilized, where the top layer could be released by a photoelectrochemical assisted etch. [33,34] Yet, this scheme can also be seen as disadvantageous because of the presence of dopants which can deteriorate the spin properties of the qubit. Alternatively, the smart cut method was frequently demonstrated to fabricate SiC thin films of any polytype on an insulator platform. [35][36][37][38] However, in this method high dose ion implantation is used, introducing substantial damage, which is as well detrimental to the qubit properties. To overcome this problem, a pathway for integration of high-quality epitaxial SiC on insulator has recently been shown. In this case, bulk SiC is wafer bonded to a SiO 2 wafer and subsequently, the bottom SiC side is reduced to the desired device layer thickness, forming a thin film of high-quality SiC on insulator. [27,39,40] With this method Q-factors in the 10 6 have been recently demonstrated in the IR range. [41,42] The design and engineering of photonic architectures, suitable to enhance, collect and guide light on chip is needed for applications in quantum photonics and quantum optomechanics. In this work, a Faraday cage-based oblique angle etch method is applied to fabricate various functional photonic devices from 4H Sil...