Optical surface analysis: a new technique for the inspection and metrology of optoelectronic films and wafers

Abstract

In response to demand for higher volumes and greater product capability, integrated optoelectronic device processing is rapidly increasing in complexity, benefiting from techniques developed for conventional silicon integrated circuit processing. The needs for high product yield and low manufacturing cost are also similar to the silicon wafer processing industry. This paper discusses the design and use of an automated inspection instrument called the Optical Surface Analyzer (OSA) to evaluate two critical production issues in optoelectronic device manufacturing: (1) film thickness uniformity, and (2) defectivity at various process steps. The OSA measurement instrument is better suited to photonics process development than most equipment developed for conventional silicon wafer processing in two important ways: it can handle both transparent and opaque substrates (unlike most inspection and metrology tools), and it is a full-wafer inspection method that captures defects and film variations over the entire substrate surface (unlike most film thickness measurement tools). Measurement examples will be provided in the paper for a variety of films and substrates used for optoelectronics manufacturing.

A double-sided surface scanning platform for sapphire substrate quality assessment

“…In Equation ( 6), ℎ is the distance between optical flat and right-angle prism. Since 𝑛 1 , 𝑛 2 and 𝜃 1 were fixed parameters, Equation ( 6) can be simplified as Equation (7), where 𝐾 is a constant determined by 𝑛 1 and 𝑛 2 and 𝜃 1 .…”

“…Therefore, 3D topography measurement has become an important quality assessment tool for sapphire substrate manufacturing [6]. Another task of sapphire substrate quality control is defect detection and characterisation [7,8]. Like other wafer manufacturing processes, this defect detection task typically includes macro inspection (for detection), and micro inspection, for charactersiation [9,10].…”

Effect of Carbon Overcoat on Heat-Assisted Magnetic Recording Performance

“…The light is focused on the disk surface where it is absorbed, reflected, and scattered. [9,10] The laser-heated tracks were marked using OSA scribe tools for subsequent magnetic force microscope (MFM) study and peak-force tunneling current atomic force microscope (PF-TUNA AFM) study. In MFM analysis, 5m MFM images were acquired at the four laser-irradiation bands.…”