2017
DOI: 10.1016/j.tsf.2017.07.016
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Optical properties of plasma-enhanced chemical vapor deposited SiCxNy films by using silazane precursors

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Cited by 16 publications
(14 citation statements)
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“…The silicon content remains at a relatively stable level of 22.7-26.4 at.% for all the samples, with a weak increasing tendency with increasing concentration of oxygen in the working gas. A similar result was reported by Chang et al [42], with a difference being a lack of reactive atmosphere. Both in their studies and in our work, the concentration of silicon in the films remains close to its content in the precursor compound.…”
Section: Elemental Composition and Chemical Structure Studies Conducted With The Help Of Xps Spectroscopysupporting
confidence: 89%
“…The silicon content remains at a relatively stable level of 22.7-26.4 at.% for all the samples, with a weak increasing tendency with increasing concentration of oxygen in the working gas. A similar result was reported by Chang et al [42], with a difference being a lack of reactive atmosphere. Both in their studies and in our work, the concentration of silicon in the films remains close to its content in the precursor compound.…”
Section: Elemental Composition and Chemical Structure Studies Conducted With The Help Of Xps Spectroscopysupporting
confidence: 89%
“…It is worth mentioning that the refractive index values reported for a‐SiCN films produced by (DP‐CVD) from TMDSN, [ 34 ] HMDSN, [ 34 ] methyltris(diethylamino)silane, [ 45 ] and divinyltetramethyldisilazane, [ 46 ] are: n = 2.1–2.3 [ 34 ] , n = 1.5–2.1 [ 45 ] ( T S = 200–400°C), and n = 1.5–1.9 [ 46 ] ( T S = 250–400°C), respectively.…”
Section: Optical Propertiesmentioning
confidence: 99%
“…11 Research about the integration of a porous low-k film and a dielectric barrier is limited. 12,13 The commonly used dielectric barriers are SiN, SiC, SiCN, SiCO, and SiCNO materials whose dielectric constant is larger than that of a porous low-k film, [9][10][11][12][13][14][15][16][17][18][19] increasing the parasitic capacitance of BEOL interconnects. Among these dielectric barriers, SiCN film is an attractive barrier because it provides relatively low dielectric constant, acceptable electrical properties, and better adhesion with Cu layer.…”
mentioning
confidence: 99%