2003
DOI: 10.1063/1.1566476
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Optical and structural properties of SiOxNyHz films deposited by electron cyclotron resonance and their correlation with composition

Abstract: SiO x N y H z films were deposited from O 2 , N 2 , and SiH 4 gas mixtures at room temperature using the electron cyclotron resonance plasma method. The absolute concentrations of all the species present in the films ͑Si, O, N, and H͒ were measured with high precision by heavy-ion elastic recoil detection analysis. The composition of the films was controlled over the whole composition range by adjusting the precursor gases flow ratio during deposition. The relative incorporation of O and N is determined by the… Show more

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Cited by 21 publications
(14 citation statements)
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“…In a previous work, we correlated the position of the main absorption band with the composition of SiO x N y films deposited using the same reactor. 26 The presence of O in the deposited films was detected even when O was unintentionally introduced in the plasma atmosphere. Additionally, a maximum of the Si-O/Si-N stretching band at 900 cm −1 was found for a composition characterized by…”
Section: Resultsmentioning
confidence: 98%
“…In a previous work, we correlated the position of the main absorption band with the composition of SiO x N y films deposited using the same reactor. 26 The presence of O in the deposited films was detected even when O was unintentionally introduced in the plasma atmosphere. Additionally, a maximum of the Si-O/Si-N stretching band at 900 cm −1 was found for a composition characterized by…”
Section: Resultsmentioning
confidence: 98%
“…Stoichiometric Si 3 N 4 has a stretching vibration mode 22 at 835 cm −1 so we attribute the measured band to the formation of SiN x during the nitridation process. The shift toward higher wave numbers may be related to O incorporation 23 to this passivation layer as a contamination from the ECR quartz chamber. Also, the width of the band points to a quite disordered layer.…”
Section: B Characterization Techniquesmentioning
confidence: 99%
“…Over the past years plenty of work has been done with several dielectric materials such as silicon nitrides [3,4,5,6] and oxynitrides [7,8,9], while nitridation of the oxide layer has been used by the semiconductor industry to reduce tunneling currents through the gate dielectric [10]. However, at the present scale of integration (65 nm process generation), the oxynitride has to be so thin (less than 1.7 nm) that tunneling currents impose severe limitations to the performance of the transistors [10].…”
Section: Introductionmentioning
confidence: 99%