2020
DOI: 10.1021/acsaem.0c02163
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Operando Investigations toward Changeover of Phase Assemblage and Associated Electrochemical Behavior during Lithiation/Delithiation Cycles of Sn-Based Intermetallic Electrodes

Abstract: Moving toward the next-generation alkali metal-ion battery systems, poor cyclic stability of "alloying-reaction"-based anode materials, such as Sn, is still an unresolved issue of immense significance. There is some interest/ promise with Cu−Sn intermetallic-based anodes (viz., primarily Cu 6 Sn 5 -based), but with the stability still lagging behind the desired level and lithiation/ delithiation mechanisms not being understood. Against this backdrop, starting with a less explored Cu−Sn intermetallic (viz., ε-C… Show more

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Cited by 6 publications
(7 citation statements)
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“…As per the Cu-Sn phase diagram, at our processing temperature of 400 °C, ∼13.8 wt % Sn is soluble in Cu. There are lots of reports available in the literature concerning the formation of Sn-Cu intermetallic compounds due to interdiffusion of the elements at even relatively lower temperatures ( viz ., even from room temperature to 250 °C). In light of this information and our SEM observations, we believe that the Sn template does not remain on the surface at our processing temperature due to alloying between Sn and Cu in the case of the acetic acid-treated copper foils, which have negligible surface oxide. Now, since there are no Sn nanoparticles on the substrate to grow SiNWs, only deposition of the amorphous silicon film takes place, and this is perhaps the reason that the growth of SiNW on copper foil via the VLS route has never been reported before.…”
Section: Resultsmentioning
confidence: 79%
“…As per the Cu-Sn phase diagram, at our processing temperature of 400 °C, ∼13.8 wt % Sn is soluble in Cu. There are lots of reports available in the literature concerning the formation of Sn-Cu intermetallic compounds due to interdiffusion of the elements at even relatively lower temperatures ( viz ., even from room temperature to 250 °C). In light of this information and our SEM observations, we believe that the Sn template does not remain on the surface at our processing temperature due to alloying between Sn and Cu in the case of the acetic acid-treated copper foils, which have negligible surface oxide. Now, since there are no Sn nanoparticles on the substrate to grow SiNWs, only deposition of the amorphous silicon film takes place, and this is perhaps the reason that the growth of SiNW on copper foil via the VLS route has never been reported before.…”
Section: Resultsmentioning
confidence: 79%
“…Similar setup and conditions were used for operando synchrotron X-ray diffraction studies also in the previously reported works with different electrode materials. [52][53][54][55][56]…”
Section: Methodsmentioning
confidence: 99%
“…The electrochemical behavior and performances of the as-developed Li-NMCs (i.e., undoped and Zn-doped Li-NMC111) as cathode materials for Li-ion cells were reported in our previously published work . Here, in order to perform the operando synchrotron diffraction experiments (as further detailed in the following sub-section, i.e., Section ), the working electrodes were prepared in the same way as for the electrochemical studies performed in Li “half” cells using CR2032-type coin cells, with the coin cells being slightly modified to enable the operando measurements during galvanostatic cycling. For the operando stress measurements as well (as detailed in a subsequent sub-section, i.e., Section ), the overall electrochemical conditions (including the potential window, electrolyte, separator, Li foil, etc.)…”
Section: Methodsmentioning
confidence: 99%
“…The diffraction patterns were recorded using MAR 345 imaging plates, which were calibrated with the NIST standard CeO 2 powder. Similar setup/conditions were used for some of our previously published works that involve operando synchrotron XRD studies. …”
Section: Methodsmentioning
confidence: 99%