Open-cell copper foam joining: Joint strength and interfacial behaviour

Zahri, Nur Amirah Mohd; Yusof, Farazila; Ariga, Tadashi; Haseeb, A.S.M.A.; Mansoor, Muhammad Adil; Sukiman, Nazatul Liana

doi:10.1080/02670836.2019.1661649

Cited by 6 publications

(6 citation statements)

References 25 publications

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“…Meanwhile, the light grey colour at the diffusion zone area indicated the enrichment with copper and tin (Sn) by spotting at points 2 and 11, and Sn was found near the end side of porous Ni, which can be seen in points 6 and 8. Tin was believed to have readily diffused from the VZ2250 BFM into porous Ni because Sn is a low melting-temperature metal and it is an active element, as well [22]. Tin and copper form a possible solid-solution phase of Cu-Sn.…”

Section: Microstructural Analysis Of Brazed Cu/porous Ni/ss304mentioning

confidence: 99%

“…Besides this, nickel and phosphorus in the VZ2250 BFM diffused into the base metals (Cu and SS304) and porous Ni due to the concentration gradient to form the diffusion layer [25]. Furthermore, some of the phosphorus will evaporate due to its high vapour properties [26] and emerge in enriching copper and tin mostly in the porous Ni area, which resulted in the formation of brittle phases: Cu3P and Cu6Sn5 [22,26]. The Cu3P and Cu6Sn5 in the BFM have melted and coalesced with the porous Ni and base metal to form a strong and comparatively brittle joint.…”

Section: Microstructural Analysis Of Brazed Cu/porous Ni/ss304mentioning

confidence: 99%

“…3 (a, d Cu/Porous Ni/SS304 samples; however, the deformation becomes plastic when excessive stresses are applied during the mechanical test. Mohd Zahri and co-researchers (2019) have reported that there occurs a pores-size reduction in the porous Ni (for both brazed and non-brazed conditions) when the compressive stresses surpass the yield strength of the cell wall [22]. For future works, it is planned to further test the bonding strength at both interfaces so the value of bonding strength can be obtained for better identification of suitable applications.…”

Section: Microstructural Analysis Of Brazed Cu/porous Ni/ss304mentioning

confidence: 99%

See 2 more Smart Citations

Investigation on Microstructure and Compressive Strength of Brazing Porous Nickel to Copper and Stainless Steel

Rozaimay,

Tuan Zahari,

Buys

et al. 2023

Acta Metall Slovaca

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This paper investigates the effects of brazing temperatures on the microstructure and compressive strength for brazing porous nickel to copper and stainless steel using VZ2250 as the brazing filler metal. A high vacuum furnace is used to braze the samples. Three different brazing process parameters were set with a heating and cooling rate of 10°C/min, respectively. The characteristics of the joint interface have been investigated to evaluate the performance of the brazed samples by use of scanning electron microscope, energy-dispersive X-Ray spectroscope, X-Ray diffractometer, and Instron Universal Testing machine. The data obtained has been quantitively analyzed to confirm the diffusion of the BFM during the brazing process. It has been found that the diffusion process resulted in an increase in the rigidity of the porous Ni. The compressive strength tests for the brazed joint showed that the maximum compressive strength can be achieved for brazing at 680°C. The highest compressive strength value has been justified by quantitative analysis of the microstructural data. It has been proved that the VZ2250 BFM effectively diffused into the porous Ni at the brazing temperature of 680°C; Cu3P and Cu6Sn5 were detected at the brazed Interface 1, whereas MnNi3 phase at the brazed Interface 2.

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Section: Microstructural Analysis Of Brazed Cu/porous Ni/ss304mentioning

confidence: 99%

Section: Microstructural Analysis Of Brazed Cu/porous Ni/ss304mentioning

confidence: 99%

Section: Microstructural Analysis Of Brazed Cu/porous Ni/ss304mentioning

confidence: 99%

See 1 more Smart Citation

Investigation on Microstructure and Compressive Strength of Brazing Porous Nickel to Copper and Stainless Steel

Rozaimay,

Tuan Zahari,

Buys

et al. 2023

Acta Metall Slovaca

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“…The joining using Zn + 2% Al filler shows higher stiffness with the diffusion of Al-rich and Zn-rich in the joining area. Zahri et al (2019) found the strength of brazed Cu foam with a Cu-4.0Sn-9.9Ni-7.8P amorphous filler is dependent on the foam pore density. The diffusion of P and Ni elements into the foam allows it to coat the foam branches and leads to the increase in foam strength.…”

Section: Introductionmentioning

confidence: 96%

Deformation and Fracture Behavior of Sandwiched Copper Foam Brazed Joint Using Amorphous Copper–Tin–Nickel–Phosphorus Filler

et al. 2021

Self Cite

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Utilization of open-cell metal foams in functional applications such as in energy absorption, noise absorber, heat insulator, and lightweight panels is trending in many industrial applications. The development of reliable joining technologies for sandwiched metal foams is crucial for thermal application and one of the techniques used is brazing process. In the current work, copper foam was sandwiched between a copper plate using amorphous filler of Cu-9.7Sn-5.7Ni-7.0P (Cu: copper, Sn: tin, Ni: nickel, and P: phosphorus) via brazing technique. The shear test was conducted on the brazed joint interface of copper/copper foam, while the compressive test was carried out on the brazed sample. Microstructures of the copper substrate surface obtained from the shear fracture of brazed copper/copper foam show the tear region and cleavage fractures. The stress–strain curve of shear and compressive strength explains the deformation behavior of the brazed sample.

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“…For electronic packaging solder joints, the performance of the solder material directly determines the performance of the solder joint [1,2]. The conventional SnPb solder is widely used, attributed to its low melting point and cost, as well as excellent wettability and mechanical properties [3].…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties

Gao

Zhang

et al. 2023

Metals

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Electromigration is one of the most important research issues affecting the reliability of solder joints. Current-induced Joule heating affects the electromigration behavior of solder joints. Solder joints with different cross-sectional areas were designed to obtain different Joule heating properties. The effects of the interfacial intermetallic compound (IMC) and mechanical properties of Sn58Bi/Cu solder joints were studied for different Joule heating properties. The results showed that as the cross-sectional area of the Sn58Bi/Cu solder joints increased, the Joule heating of the joint increased. The anode IMC thickness of the joint thickened and transformed into a planar shape. The Bi migrated to the anode region to form a Bi-rich layer and gradually increased in thickness. The cathode IMC thickness first increased, then decreased, and gradually dissolved. The Sn-rich layer formed near the solder side and gradually increased in thickness, with microcracks occurring when the cross-sectional area of the joint increased to 0.75 mm2. The joint shear fracture path moved from the soldering zone near the cathode IMC layer to the interfacial IMC layer. The fracture mechanism of the joint changed from a mixed brittle/tough fracture, dominated by deconstruction and secondary cracking, to a brittle fracture dominated by deconstruction. The joint shear strength was reduced by 60.9% compared to that in the absence of electromigration.

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Open-cell copper foam joining: Joint strength and interfacial behaviour

Cited by 6 publications

References 25 publications

Investigation on Microstructure and Compressive Strength of Brazing Porous Nickel to Copper and Stainless Steel

Investigation on Microstructure and Compressive Strength of Brazing Porous Nickel to Copper and Stainless Steel

Deformation and Fracture Behavior of Sandwiched Copper Foam Brazed Joint Using Amorphous Copper–Tin–Nickel–Phosphorus Filler

Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties

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